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Thermal Conductive Gap Filler 2.0mmT 1.8W/MK For Micro Heat Pipe Thermal Solutions

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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China

Contact name:Dana

Dongguan Ziitek Electronical Material and Technology Ltd.

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Thermal Conductive Gap Filler 2.0mmT 1.8W/MK For Micro Heat Pipe Thermal Solutions

Country/Region	china
City & Province	dongguan guangdong
Categories	Other Metals & Metal Products

Product Details

Factory supply low cost thermal conductive gap filler,2.0mmT 1.8W/mK for micro heat pipe thermal solutions

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

TIF100-18-01US-Specification-sheet.pdf

TIF180-18-01US is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling TIF180-18-01US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. TIF180-18-01US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request

Features

<Good thermal conductive:1.8W/mK

<Thickness:2.0mmT

<Hardness:18 Shore 00

<Colour: black

<Easy release construction

<High tack surface reduces contact resistance

<Outstanding thermal performance

Applications

<Mass storage devices

<Automotive electronics

<Set top boxes

<Audio and video components

<IT infrastructure

<Micro heat pipe thermal solutions

<Automotive engine control units

<Telecommunication hardware

Typical Properties of TIF180-18-01US
Product Name	TIF180-18-01US Series
Colour	black
Construction & Compostion	Ceramic filled silicone elastomer
Specific gravity	2.5 g/cc
Thickness	2.0mmT
Hardness	18 Shore 00
Dielectric constant@1MHz	4.5 MHz
Continuos Use Temp	-40to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal conductivity	1.8 W/mK
Volume Resistiviyt	1.0*10^12 _Ohm-cm

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

FAQ

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.