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Thermal Pad For High Speed Mass Storage Drives 5.0mmT TIF1200-30-11US

Dongguan Ziitek Electronical Material and Technology Ltd.

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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China

Contact name:Dana

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Dongguan Ziitek Electronical Material and Technology Ltd.

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Thermal Pad For High Speed Mass Storage Drives 5.0mmT TIF1200-30-11US

Country/Region china
City & Province dongguan guangdong
Categories Photo Paper
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Product Details

Excellent Wet-Out Thermal Pad for High speed mass storage drives,5.0mmT TIF1200-30-11US


Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

 

TIF100-30-11US-Series-Datasheet-.pdf

 
TIF1200-30-11US is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling TIF1200-30-11US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. Ziitek TIF1200-30-11US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request
 
Features
<Good thermal conductive:3.0W/mK
<Thickness:5.0mmT
<Hardness:20±5  Shore 00
<Colour: gray

<Outstanding thermal performance

<High tack surface reduces contact resistance

<Fiberglass reinforced for puncture, shear and tear resistance

<Easy release construction

 
Applications

<High speed mass storage drives

<Heat Sinking Housing at LED-lit BLU in LCD

<LED TV and LED-lit lamps

<GPS navigation and other portable devices

<CD-Rom, DVD-Rom cooling

<LED Power Supply

<LED Controller

<LED Ceilinglamp


 

 
Typical Properties of TIF1200-30-11US
 
Product Name  

 TIF1200-30-11US Series

Colour
gray 
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

5.0mmT
Hardness
20±5Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
 3.0W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

FAQ

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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