Dongguan Ziitek Electronical Material and Technology Ltd. |
Verified Suppliers
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20±5 Shore 00 high cost-effective thermal conductive gap filler for Telecommunication hardware
Company Profile
With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
<Fiberglass reinforced for puncture, shear and tear resistance
<Easy release construction
<Electrically isolating
<Telecommunication hardware
<Handheld portable electronics
<Semiconductor automated test equipment (ATE)
<CPU
<Audio and video components
<IT infrastructure
<GPS navigation and other portable devices
<CD-Rom, DVD-Rom cooling
Typical Properties of TIF1100-30-11US | |||
Product Name | TIF1100-30-11US Series | ||
Colour | gray | ||
Construction & Compostion | Ceramic filled silicone elastomer | ||
Specific gravity | 3.0 g/cc | ||
Thickness | 2.5mmT | ||
Hardness | 20±5Shore 00 | ||
Dielectric constant@1MHz | 4.0 MHz | ||
Continuos Use Temp | -40to 160℃ | ||
Dielectric Breakdown Voltage | >5500 VAC | ||
Thermal conductivity | 3.0W/mK | ||
Volume Resistiviyt | 1.0*1012 Ohm-cm |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Advantage
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.