|
[China]
Trade Verify
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China
Contact name:Dana
Dongguan Ziitek Electronical Material and Technology Ltd. |
|
Verified Suppliers
|
|
|
Memory Modules applicative grey Ultra thin thermal conductive low melting point thermal pad pcm phase change materials
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
The TIC™800G Series is low melting point thermal interface material. At 50℃, The
TIC™800G Series begins to soften and flow, filling the microscopic
irregularities of both the thermal solution and the integrated
circuit package surface, thereby reducing thermal resistance.The
TIC™800G Series is a flexible solid at room temperature and
freestanding without reinforcing components that reduce thermal
performance.
The TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does
not fully change state resulting in minimal migration (pump out)at
operating temperatures.
TIC800G Series Datasheet-(E)-REV01.pdf
Features
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Typical Properties of TIC™800G Series
| |||||
Product Name | TICTM805G | TICTM808G | TICTM810G | TICTM812G | Testing standards |
Color | Gray | Gray | Gray | Gray | Visual |
Composite Thickness | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.012" (0.305mm) | |
Thickness Tolerance | ±0.0008'' (±0.019mm) | ±0.0008" (±0.019mm) | ±0.0012" (±0.030mm) | ±0.0012" (±0.030mm) | |
Density | 2.6g/cc | Helium Pycnometer | |||
Work Temperature | -25℃～125℃ | ||||
phase transition temperature | 50℃~60℃ | ||||
Thermal conductivity | 5.0 W/mK | ASTM D5470 (modified) | |||
Thermal lmpedance @ 50 psi(345 KPa) | 0.013℃-in²/W | 0.014℃-in²/W | 0.038℃-in²/W | 0.058℃-in²/W | ASTM D5470 (modified) |
0.08℃-cm²/W | 0.09℃-cm²/W | 0.25℃-cm²/W | 0.37℃-cm²/W | ||
Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.012"(0.305mm)
Consult the factory alternate thickness.
Standard Sizes:
9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom
liner. TIC™800 series is available in kiss cut an extended pull tab
liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series
products.
Reinforcement:
No reinforcement is necessary.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
