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3.0w Mk Thermal Gap Pad Gray Easy Release Construction Silicone For It Infrastructure

Dongguan Ziitek Electronic Materials & Technology Ltd.

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3.0w Mk Thermal Gap Pad Gray Easy Release Construction Silicone For It Infrastructure

Country/Region china
City & Province dongguan guangdong
Categories Adhesives & Sealants
InquireNow

Product Details

3.0W Gray Easy Release Construction Silicone Pads for IT Infrastructure

 

     The TIF1160-30-02US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

 

 

TIF100-30-02US-Datasheet-REV02.pdf

 

Features

> Good thermal conductive: 3.0 W/mK 

>Thickness:4.0mmT

>hardness:20 shore 00

>Colour: Gray

>Moldability for complex parts

>Soft and compressible for low stress applications

>Naturally tacky needing no further adhesive coating

 

 

Applications

>Automotive electronics

>Set top boxes

>Audio and video components

>IT infrastructure

>GPS navigation and other portable devices

>CD-Rom, DVD-Rom cooling

 

Typical Properties of TIF1160-30-02US Series
Color
Gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.9 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
4.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
20 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
3.8 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 

 

 

 

 

 

 

 

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

 

FAQ:

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

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