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Die Cut Thermal Conductive Silicone Gap Filler Pad 12±5 Shore00 1.5w For Cpu Heat Sinking

Dongguan Ziitek Electronic Materials & Technology Ltd.

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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

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Die Cut Thermal Conductive Silicone Gap Filler Pad 12±5 Shore00 1.5w For Cpu Heat Sinking

Country/Region china
City & Province dongguan guangdong
Categories Other Rubber Products
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Product Details

Die Cut Thermal Conductive Silicone Gap Filler Pad 12±5 shore00 Thermal Conductivity 1.5w for Cpu heat sinking

 

     The TIF120-05ES thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. 

 

TIF100-05ES-Datasheet.pdf


Features


> Good thermal conductive: 1.5 W/mK 

>Thickness:0.5mmT

>hardness:12±5 shore00
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
 


Applications


> Cpu heat sinking 
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF™120-05ES Series
Color
Gray 
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Density
2.0 g/cm3
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Heat Capacity
1 l/g-K
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
12±5 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.30%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.5 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 

 

 

 

 

 

 

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

 

FACTORY INFORMATION:

 

Factory Size

5,000-10,000 square meters

 

Factory Country/Region

Building B8, Industry District , Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China

 

Annual Output Value

US$1 Million - US$2.5 Million

 
 
 

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