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Thermal Conductive Gap Pad For GPS Navigation And Portable Devices 1.2w/MK

Dongguan Ziitek Electronic Materials & Technology Ltd.

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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

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Thermal Conductive Gap Pad For GPS Navigation And Portable Devices 1.2w/MK

Country/Region china
City & Province dongguan guangdong
Categories Screen Protectors
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Product Details

1.2w/MK professional factory thermal conductive gap pad for GPS navigation and other portable devices
The TIF180-12-05ES is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
 
TIF100-12-05ES-Series-Datasheet.pdf
 
Features:
>  Good thermal conductive: 1.2 W/mK 
>Thickness:2.0mmT
>hardnesses :12±5 (Shore 00)
>RoHS compliant
>UL recognized
 
Applications:
>GPS navigation and other portable devices
>CD-Rom, DVD-Rom cooling
>LED Power Supply
>Micro heat pipe thermal solutions
>Automotive engine control units
 

 
Typical Properties of TIF180-12-05ES Series
Color

blue

VisualComposite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

desity

2.0 g/cm3

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Thickness

2.0mmT

***

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
12±5  (Shore 00)ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77 

Tensile Strength 

40 psi

ASTM D412

90mils / 2.286 mm

1.91 

100mils / 2.540 mm

2.05

Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

2.16   

120mils / 3.048 mm

2.29   

Dielectric Breakdown Voltage
>5500 VACASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
4.5MHzASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
1.0X1012
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05 

200mils / 5.080 mm

3.14

 
Thermal conductivity 
1.2 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
 
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
 
Advantage
 
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.




























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