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Thermal Phase Changing Low Melting Materials , Heat Sensitive Materials For Notebook
TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
TIC™800G Series shows no thermal performance degradation after
1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The
material softens and does not fully change state resulting in
minimal migration (pump out)at operating temperatures.
TIC800G Series Datasheet-(E)-REV01.pdf
Applications Include:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Features:
For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive
required
> No heat sink preheating required
| Typical Properties of TICTM812G Series | |||||
| Product Name | TICTM805G | TICTM808G | TICTM810G | TICTM812G | Test Method |
| Color | Gray | Gray | Gray | Gray | Visual |
| Thickness | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.012" (0.305mm) | |
| Thickness Tolerance | ±0.0008'' (±0.019mm) | ±0.0008'' (±0.019mm) | ±0.0012'' (±0.030mm) | ±0.0012'' (±0.030mm) | |
| Density | 2.6g/cc | Helium Pycnometer | |||
| Temperature range | -25℃～125℃ | ||||
| Phase Change Softening Temperature | 50℃~60℃ | ||||
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 (modified) | |||
| Thermal Impedance @ 50 psi(345 KPa) | 0.014℃-in²/W | 0.020℃-in²/W | 0.038℃-in²/W | 0.058℃-in²/W | ASTM D5470 (modified) |
| 0.09℃-cm²/W | 0.13℃-cm²/W | 0.25℃-cm²/W | 0.37℃-cm²/W | ||
Standard Thicknesses:
0.005"(0.127mm)
0.008"(0.203mm)
0.010"(0.254mm)
0.0012"(0.305mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm)
16" X 400' (406mm X
121.92M)
TIC™800 series are supplied with a white release paper and a bottom
liner. TIC800™ series is available in kiss cut an extended pull tab
liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series
products.
Reinforcement:
No reinforcement is necessary.
