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Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

Dongguan Ziitek Electronic Materials & Technology Ltd.

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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

Contact name:Dana

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Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer

Country/Region china
City & Province dongguan guangdong
Categories Gaskets
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Product Details

 

Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
 
  The TIF860HP 
   
   use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
 
Features:
 

Available in varies thicknesses 12 W/mK
Broad range of hardnesses available
Moldability for complex parts
Outstanding thermal performance
High tack surface reduces contact resistance

 
Applications:
 

Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices
CD-Rom, DVD-Rom cooling
LED Power Supply

 

Typical Properties of TIF860HP
Color

gray

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***10mils / 0.254 mm0.21
20mils / 0.508 mm0.27
Hardness(Shore00 Thickness ≥0.75mm)

40

ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Hardness(Shore00 Thickness <0.75mm)

65

ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Density(g/cm3)3.55ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Thickness range

0.030''~0.200''

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage
≥5500 VACASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
4.5 MHzASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
1.0X1012
Ohm-meter
ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V-0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
12 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

 

 
Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer
6.Quality assurance contract
 

Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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