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Thermal conductive One Component epoxy adhesive TIE380-25 2.5w/mk conductivity for gluing metal and PCB
TIE™380-25High Performance Thermal Conductivity Of The Epoxy Adhesive
Product Summary:
TIE™380-25 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength. TIE™380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.
Feature
>Good thermal conductivity: 2.5W/mK
>Good maneuverability andadhesion performance
>Low shrinkage
>Low viscosity, easy-to-gas emissions
>Good solvent resistance, water resistance
>Longer working hours
>Excellent resistance to thermal shock
| Typical Properties of TIETM380-25 | ||
| Chemical type | Epoxy | Test Method |
| Appearance uncured | Gray Paste | Visual |
| Appearance cured | Dull Gray Solid | Visual |
| Components | One Component | ***** |
| Heat Capacity | 0.7 l/g-K | ASTM C351 |
| Key Substrates | Metals, ceramics | ***** |
| Hardness | 92 Shore A | ASTM 2240 |
| Continuous Use Temp | -40 to 180℃ | ***** |
| Tensile strength Al/Al @25°C | >2800psi | ***** |
| Thermal Conductivity | 2.5 W/m-K | ASTM D5470 |
Application Features:TIE™380-25
Color Gray
Viscosity@25℃ 140,000 cPs
Specific Gravity@25℃ 2.1 g/cc
Shelf life @25℃° 10 Days
@0℃° 6 Months
(Storage methods and temperature will affect the shelf life)
Curing procedures:
Curing temperature Curing time
100℃° 3 Hours
125℃ 1.5 Hour
150℃ 20 Minutes
170℃ 5 Minutes
