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High Performance 2W Conductivity Non - Silicone Gap Filler 2.65 g/cc The metal oxide fills Zpaster160-20-11F

Dongguan Ziitek Electronic Materials & Technology Ltd.

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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

Contact name:Dana

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High Performance 2W Conductivity Non - Silicone Gap Filler 2.65 g/cc The metal oxide fills Zpaster160-20-11F

Country/Region china
City & Province dongguan guangdong
Categories Bromide
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Product Details

New thermal management solution products 1.5mmT silicone-free thermal pad Zpaster160-20-11F 2W conductivity

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

 Zpaster160-20-11F  is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.

It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

Features

 

>Good thermal conductive:2.0 W/mK

>Soft and Compressible for low stress applications

>Available in varies thickness

>Silicone-free

>ROSH compliance

 

Application

 

>Car Battery & Power Supply

>Charging Pile

>Silicone-sensitive applications

>Graphics Card Thermal Module

>Set Top Box

> Medical devices

>LED Lighting

>SFP optical module

 

                                              Typical Properties of Z-Paster160-20-11F Series 
ColorDark greyVisualDielectric Breakdown Voltage (T= 1mm above)>5000 VACASTM D149 
 
ConstructionSilicone-free The metal oxide fills**********Dielectric Constant5.5 MHzASTM D150 
 
Thermal Conductivity2.0 W/mKASTM D5470Volume Resistivity6.0X1013 Ohm-meterASTM D257 
 
Hardness65 Shore 00ASTM 2240Continuous Use Temp– 20 To 125 ********** 
 
Specific Gravity2.65 g/ccASTM D297Outgassing (TML)0.30%ASTM E595 
 
Thickness range1.5mmASTM D374Flame Rating94 V0equivalent to

 

Standard size 

0.010-inch to 0.200-inch (0.25mm to 5.0mm)

 

Options

Proprietary NS1 option available to eliminate tack from one side to aid in handling.

 

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

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