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[China]
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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Contact name:Dana
Dongguan Ziitek Electronic Materials & Technology Ltd. |
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Blue 3W Thermally Conductive Putty Gap Filler high viscosity TIF030-05 For Micro Heat Pipe
TIF030-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF030-05 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF030-05 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF030-05 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
TIF030-05 Series Datasheet-REV02.pdf
Application
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe ,Vihicel enginee controler
>Telecom industry
Feature
>Thermal conductivity: 3.0W/mK
>Soft, very low compression
>Operate automaticly
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
| TIFTM030-05 Property | |||
| Color | Blue | Visual | |
| Construction & Composition | Ceramic filled silicon material | ********** | |
| Viscosity | 2000,000cps | GB/T 10247 | |
| Specific Gravity | 2.95 g/cc | ASTM D297 | |
| Thermal conductivity | 3.0 W/mK | ISO 22007-2 | |
| Thermal diffusivity | 1.053 mm2/s | ISO 22007-2 | |
| Specific heat capacity | 3.2 MJ/m3K | ISO 22007-2 | |
| Continuous Use Temperature | -45 ~200°C | ****** | |
| Dielectric breakdown strength | 200 V/mil | ASTM D149 | |
| Flame Rating | 94V0 | E331100 | |
| Outgassing,%TML | 0.80% | ASTM E595 | |
Package :
30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us
4. We will reply you as soon as possible with Email or online
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
