Lab Alternative Climatic Test Chamber Rapid Change Temperature Testing With Microprocessor

Lab Alternative High and Low Cycling Temperature Climatic Test Chamber with Microprocessor

Choosing Chamber Size:

Choosing a correct chamber size depends on the application and your available floor space. The suggested ratio is about 1:3 between product volume and the working volume of the chamber.

⅓ product to ⅔ empty space around the product ensures adequate airflow to the test sample and makes sure your test is conducted properly. Items that allow for airflow (such as a computer chassis with plenty of air vents) can take up a larger percentage of the test volume.

Externally, consider that these machines create a lot of heat, and with test cycling up and down the temperature spectrum, the chambers themselves require good air circulation. Some units will require up to three feet (or more) of clearance in all directions to work properly.

Depending on whether the test product is a live load, a larger chamber may be needed to dissipate heat produced by the test subject, adversely affecting the chamber’s pull down times or humidity system.

Sand, dust, and high altitude chambers do not need a 1:3 ratio of product volume and empty space. The air speed inside the chamber is already very high for the products and makes a 1:3 ratio unnecessary.

These chambers should be just slightly bigger than your test product.

Brief Introduction:

Rapid change temperature testing specifies a test sample temperature variation rate of 15°C/minute or less, which is the biggest difference between this method and thermal shock testing. Since rapid change temperature testing achieves highly repeatable test results, it is used for compliance testing for standards such as JEDEC (JESD 22-A104B).

With the ongoing rise in issues affecting the reliability of electronic devices and circuit boards, a better-suited evaluation testing method is needed to respond to issues such as higher device operation temperatures resulting from greater semiconductor integration, changes in device mounting methods such as BGA and CSP, and the use of lead-free solder.

Rapid change temperature testing is a type of thermal cycling tests developed to improve the failure repeatability of thermal shock tests.

Features:

1, Available internal chamber volumes: 150L, 225L, 416L, 800L and 1000L;

2, To preset different heating and cooling rate: 5℃/min, 10℃/min, 15℃/min;

3, Support rapid change temperature test, condensation test, high temperature/humidity test, temperature/humidity loop test, etc.

4, Complete real time curve display;

5, Conform but not limited standards: MIL-STD-2164, MIL-344A-4-16, GJB-1032-90, GJB/Z34-5.1.6, etc.

Technical Specifications: