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High-Precision SMT PCB Line Machine SMD BGA Rework Station Machine

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Contact name:Wei.feng

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High-Precision SMT PCB Line Machine SMD BGA Rework Station Machine

Country/Region	china
Categories	Bag Making Machinery Parts

Product Details

electronic products machinery pcb line machine smd bga rework station Machine

The BGA rework station machine is a specialized equipment used in the electronics industry for the rework and repair of ball grid array (BGA) components on printed circuit boards (PCBs). It offers a range of functionality and features that enable the safe removal and replacement of BGAs, ensuring reliable and efficient rework processes.

Functionality:

1. BGA Removal: The BGA rework station machine utilizes a combination of heat, airflow, and specialized tools to safely remove BGA components from PCBs. It applies controlled heat to soften the solder underneath the BGA, allowing for the careful extraction of the component without damaging the surrounding PCB or nearby components.

2. Component Alignment and Positioning: The machine ensures accurate alignment and positioning of the BGA during the rework process. It may include features such as vision systems or alignment guides to precisely place the BGA on the PCB, ensuring proper alignment with the solder pads.

3. Solder Paste Dispensing: The machine can dispense solder paste onto the solder pads of the PCB before reattaching the BGA. This ensures a proper and reliable solder joint connection between the BGA and the PCB, enhancing the overall quality and reliability of the reworked component.

4. Component Reattachment: The BGA rework station machine enables the precise reattachment of the BGA onto the PCB. It uses a combination of controlled heat, pressure, and solder reflow techniques to create a strong and reliable solder joint connection between the BGA and the PCB.

5. Temperature Control: The machine provides precise temperature control during the rework process. It allows for the adjustment of temperature profiles to match the specific rework requirements of different BGA components and PCBs. This ensures optimal heating and cooling cycles, minimizing the risk of thermal damage to the components and the PCB.

6. Process Monitoring and Control: The machine often includes monitoring and control features to ensure the rework process is carried out accurately and safely. It may provide real-time temperature monitoring, process timers, and alarms to alert operators of any deviations or abnormal conditions during the rework process.

Usage Range:

The BGA rework station machine is used in various applications within the electronics industry, including:

1. BGA Rework and Repair: The machine is primarily used for the rework and repair of BGA components on PCBs. It allows for the removal and replacement of faulty or damaged BGAs, enabling the repair of defective electronic devices without the need for complete board replacement.

2. Prototype Development: The machine is valuable during the prototype development stage of PCB assembly. It allows for the rework of BGAs to accommodate design changes or resolve issues encountered during the testing and validation process.

3. Component Upgrades: The BGA rework station machine is used for upgrading and replacing BGA components with newer versions or higher-performance alternatives. It enables the replacement of outdated BGAs with minimal disruption to the surrounding PCB and components.

4. Component Salvaging: In cases where BGAs need to be salvaged from damaged or faulty PCBs, the machine can safely remove the BGA components for reuse. This is particularly useful for recovering valuable components and minimizing material waste.

5. BGA Inspection and Testing: The machine can facilitate the inspection and testing of reworked BGAs. It allows for post-rework inspection, such as visual inspection, X-ray inspection, or electrical testing, to verify the quality and reliability of the reworked components.

The BGA rework station machine plays a critical role in the rework and repair of BGA components on PCBs. It enables the safe removal and replacement of BGAs, ensuring reliable and efficient rework processes in the electronics industry.

	WZ-580	WZ-620	WZ-650	WZ-750
Power	AC 220V±10% 50Hz	AC 220V±10％ 50/60Hz	AC 110V / 220V±10% 50/60Hz	AC 110V / 220V±10% 50/60Hz
Overall dimension	L500mmW590mmH650mm	L650×W630×H850mm	L 600W 640H 850mm	L830×W670×H850mm
PCB size	Max 400mm370mm Min 10mm10mm	Max 450×390mm Min 10×10 mm	Max 400mm370mm Min 10mm10mm	MAX 550×480mm MIN 10×10mm( customizable )
BGA chip size	Max 60mm60mm Min 1mm1mm	Max 60mm60mm Min 1mm1mm	MAX 7070mm -MIN 11 mm	Max 60mm60mm Min 1mm1mm
PCB thickness	0.3-5mm	0.3-5mm	0.3 - 5mm	0.5-8mm
Weight of machine	40KG	60kg	60KG	90kg
Warranty	1 year	1 year	1 year	1 year
Total power	4800W	5300w	6400W	6800W
Usage	Repair chips / phone motherboard etc	Repair chips / phone motherboard etc	Repair chips / phone motherboard etc	Repair chips / phone motherboard etc
Electrical material	Touch screen+Temperature control module+PLC control	Driving motor+PLC smart temp.controller+color touch screen	Driving motor + smart temp. controller + color touch screen	Touch screen+Temperature control module+PLC control
Location way	V-shape card slot+Universal jigs	V-shape card slot+Universal jigs	V-shape card slot+Universal jigs	V-shape card slot+Universal jigs

MODEL	WZ-580	WZ-620	WZ-650	WZ-750
Power	AC 220V±10% 50Hz	AC 220V±10％ 50/60Hz	AC 110V / 220V±10% 50/60Hz	AC 110V / 220V±10% 50/60Hz
Overall dimension	L500mmW590mmH650mm	L650×W630×H850mm	L 600W 640H 850mm	L830×W670×H850mm
PCB size	Max 400mm370mm Min 10mm10mm	Max 450×390mm Min 10×10 mm	Max 400mm370mm Min 10mm10mm	MAX 550×480mm MIN 10×10mm( customizable )
BGA chip size	Max 60mm60mm Min 1mm1mm	Max 60mm60mm Min 1mm1mm	MAX 7070mm -MIN 11 mm	Max 60mm60mm Min 1mm1mm
PCB thickness	0.3-5mm	0.3-5mm	0.3 - 5mm	0.5-8mm
Weight of machine	40KG	60kg	60KG	90kg
Warranty	1 year	1 year	1 year	1 year
Total power	4800W	5300w	6400W	6800W
Usage	Repair chips / phone motherboard etc	Repair chips / phone motherboard etc	Repair chips / phone motherboard etc	Repair chips / phone motherboard etc
Electrical material	Touch screen+Temperature control module+PLC control	Driving motor+PLC smart temp.controller+color touch screen	Driving motor + smart temp. controller + color touch screen	Touch screen+Temperature control module+PLC control
Location way	V-shape card slot+Universal jigs	V-shape card slot+Universal jigs	V-shape card slot+Universal jigs	V-shape card slot+Universal jigs