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Mini components driver board smt pick and place machine

Shenzhen Eton Automation Equipment Co., Ltd.

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Address: HENGFENG INDUSTRIAL AREA,ZHOUSHI ROAD NO. 739,HEZHOU COMMUNITY,HANGCHENG STREET,BAOAN,SHENZHEN,CHINA

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Mini components driver board smt pick and place machine

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

Mini components driver board SMT pick and place machine

 

IC (Integrated Circuit)

 

An integrated circuit is a miniature electronic device or component. Using a certain process, components and wirings such as transistors, resistors, capacitors and inductors required in a circuit are interconnected, fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a package. , become a miniature structure with the required circuit functions; in which all components have been formed into a whole in structure, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented by the letters "IC" in the circuit. The inventors of integrated circuits are Jack Kilby (germanium (Ge)-based integrated circuits) and Robert Noyce (silicon (Si)-based integrated circuits). Most applications in the semiconductor industry today are silicon-based integrated circuits

 

IC mounting machine

 

YT202S is the high precision mounting machine, it is suitable for mini component is 0201, max components is 0402, widely apply to many kind of electrical board manufacturing. Such as the PLCC/QFP/SOP/SOT/CSP/BGA/etc

ETON New upgrade mounting machine YT202S also is equipped with IC tray car and the Feeder Car, more intelligent and convenient for factory manufacturing.

 

Machine parameter

 

ModelYT202S Mounting speed80000 CPH
Mini PCB Size50*50 mm Max PCB Size500*300 mm
PCB thickness0.5-4.5mm No. of Camera4 sets digital camera
Mounting height≦20mm Power6KW
Component rangeMini 0201-40*40mm tape reel package and IC tray feeder, etc.

SOP Mounting

 

SOP packaging is a form of component packaging. Common packaging materials are: plastic, ceramic, glass, metal, etc. Now plastic packaging is basically used, mainly used in various integrated circuits. SOP package has a wide range of applications, and gradually derived SOJ (J-pin small outline package), TSOP (thin small outline package), VSOP (very small outline package), SSOP (shrinked SOP), TSSOP (thin small outline package) The reduced SOP), SOT (Small Outline Transistor), SOIC (Small Outline Integrated Circuit), etc. have played a pivotal role in integrated circuits.

YT202S Suitable for all kinds of IC package mounting

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