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Fr4 Multilayer Osp Pcb Fabrication Service Printed Circuit Board Manufacturer

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Address: Room 502, 26# Building, Funing Hi-Tech Industrial Park, Fuhai Street, Bao'an, Shenzhen, Guangdong, China, 518103

Contact name:Helen Jiang

Shenzhen KAZ Circuit Co., Ltd

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Fr4 Multilayer Osp Pcb Fabrication Service Printed Circuit Board Manufacturer

Country/Region	china
City & Province	shenzhen guangdong
Categories	Other Plastic Products

Product Details

HASL/ENIG/OSP surface FR4 Multilayer Printed Circuit Board Assembly Manufacturer

Detail Specifications:

Layers	1~20 Layers
Material	FR-4, Aluminum, Copper Base
Board Thickness	0.3mm~4mm
Copper Thickness	0.5~4oz
Surface Treatment	HASL LF / ENIG / OSP etc.
Soldmask & Silkscreen	Green/Blue/Black/White/Yellow etc.
Quality Standard	IPC Class 2, 100% E-testing
Certificates	TS16949, ISO9001, UL, RoHS

What KAZ Circuit can do for you:

PCB & PCBA Design
PCB manufacturing (prototype, small to medium, mass production)
Components Sourcing
PCB Assembly/SMT/DIP

To get a full quotation of the PCB/PCBA, pls provide the information as below:

Gerber File, with detail specification of the PCB
BOM List (Better with excel fomart)
Photoes of the PCBA (If you have done this PCBA before)

Company Informaiton:

KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!

Manufacturer Capacity:

Capacity	Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month
Min Line Width/Gap	4/4 mil (1mil=0.0254mm)
Board Thickness	0.3~4.0mm
Layers	1~20 layers
Material	FR-4, Aluminum, PI
Copper Thickness	0.5~4oz
Material Tg	Tg140~Tg170
Max PCB Size	600*1200mm
Min Hole Size	0.2mm (+/- 0.025)
Surface Treatment	HASL, ENIG, OSP

SMT Capacity

SMT Capacity
SMT Item	Capacity
PCB Max. size	510mm*1200mm(SMT)
Chip component	0201, 0402, 0603, 0805, 1206 package
Min.pin space of IC	0.1mm
Min. space of BGA	0.1mm
Max.precision of IC assembly	±0.01mm
Assembly capacity	≥8 million piots/day
DIP capacity	6 DIP production lines
Assembly testing	Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)
FCT(Functional Circuit Test)	Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement.