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FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask

Shenzhen KAZ Circuit Co., Ltd

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[China] country

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Address: Room 502, 26# Building, Funing Hi-Tech Industrial Park, Fuhai Street, Bao'an, Shenzhen, Guangdong, China, 518103

Contact name:Helen Jiang

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Shenzhen KAZ Circuit Co., Ltd

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FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask

Country/Region china
City & Province shenzhen guangdong
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Product Details

Detailed Informations:

 

4 Layers FR4 PCB, Electronic Circuit Board Assembly& Multilayer-PCBA Assembly

 

1. Features

1. Surface Mount PCB assembly (Both rigid PCB, flexible PCB);FR4 Material, Meet 94V0 standard
2. One Stop OEM Service,&PCBA contract manufacturing:
3. Electronic contract manufacturing service
4. Through hole assembly/DIP assembly;
5. Bonding assembly;
6. Final assembly;
7. Full Turnkey Box Build
8. Mechanical / electrical assembly
9. Supply Chain Management/Components procurement
10. PCB fabrication;
11. Technical support/ ODM service

12. Surface treament:OSP, ENIG,Lead Free HASL, Environmental Protection

13. UL, CE, ROHS Compliant

14. Shipping By DHL,UPS, TNT, EMS or Customer requirement

15. Anti-static bag

2. PCBA Technical capability

 

SMTPosition accuracy:20 um
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
Max. component height::25mm
Max. PCB size:680×500mm
Min. PCB size:no limited
PCB thickness:0.3 to 6mm
PCB weight:3KG
Wave-SolderMax. PCB width:450mm
Min. PCB width: no limited
Component height:Top 120mm/Bot 15mm
Sweat-SolderMetal type :part, whole, inlay, sidestep
Metal material:Copper , Aluminum
Surface Finish:plating Au, plating sliver , plating Sn
Air bladder rate:less than20%
Press-fitPress range:0-50KN
Max. PCB size:800X600mm
TestingICT,Probe flying,burn-in,function test,temperature cycling

 

 

2. PCBA Pictures

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