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[China]
Trade Verify
Address: Room 502, 26# Building, Funing Hi-Tech Industrial Park, Fuhai Street, Bao'an, Shenzhen, Guangdong, China, 518103
Contact name:Helen Jiang
ShenZhen KaiZhuo Electronic Technology Co.,Ltd |
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Verified Suppliers
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10 layers FR4 ENIG PCB Circuit Board Manufacturing with golden finger
Detail Specifications:
| Layers | 10 |
| Material | FR-4 |
| Board Thickness | 1.6mm |
| Copper Thickness | 1oz |
| Surface Treatment | HASL |
| Soldmask & Silkscreen | Green & White |
| Quality Standard | IPC Class 2, 100% E-testing |
| Certificates | TS16949, ISO9001, UL, RoHS |
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the
information as below:
Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from
China since 2007, also provide PCB Assembly service for our
customers. Now with about 300 employees. Certified with
ISO9001,TS16949, UL, RoHS. We are confident to provide you quality
products with factory-directed price within the fastest delivery
time!
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
SMT Capacity
Multilayer PCB is a printed circuit board made of more than two layers of copper
foil. It consists of an inner copper foil, an insulating substrate
and an outer copper foil, and the interconnection between the
layers is achieved by drilling and copper plating. Compared with
single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.
Advantages of multi-layer PCBs:
Higher wiring density and complex circuit design
capabilities
Better electromagnetic compatibility and signal
integrity
Shorter signal transmission paths, improved circuit
performance
Higher reliability and mechanical strength
More flexible power and ground distribution
Composition of multi-layer PCBs:
Inner copper foil: Provides conductive layer and
wiring
Insulating substrate (FR-4, high-frequency low-loss
dielectric, etc.): Isolates and supports each copper foil layer
Outer copper foil: Provides surface wiring and
interface
Perforated metallization: Realizes electrical
connection between layers
Surface treatment: HASL, ENIG, OSP and other surface
treatment processes
Design and manufacture of multi-layer PCBs:
Circuit design: Signal integrity, power/ground
integrity design of multi-layer boards
Layout and wiring: Reasonable layer allocation and
routing optimization
Process design: Aperture size, layer spacing, copper
foil thickness, etc.
Manufacturing process: Lamination, drilling, copper
plating, etching, surface treatment, etc.
More photoes of this 10 layers FR-4 ENIG High Tg PCB Circuit Board Manufacturing with golden finger
