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HDF1575M P2 Saw Bandpass Filter

hanse-john electronic Co.,Ltd.
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Address: Dongxing Road, Golden Bay Industrial Zone, Dongjiang Town, Binhu District, Wuxi City, Jiangsu Province Hansejohn Electronics

Contact name:Hongmao Liu

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hanse-john electronic Co.,Ltd.

HDF1575M P2 Saw Bandpass Filter

Country/Region china
City & Province wuxi jiangsu
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Product Details

1. Features

·SAW filter for GPS.

·High stability and reliability with good performance and no adjustment.

·Narrow and sharp pass band characteristics.

·Low insertion loss and deep stop band attenuation for interference.

·Low – loss SAW filter for GPS.

 

2. ELECTRICAL SPECIFICATION

 

ItemsConditions
Operation temperature rang-30℃ ~ +85℃
Storage temperature rang-40℃ ~ +85℃

ESD voltage

Sensitive discharge device

ESD(MM) : 50VDC

ESD(HBM) : 175VDC

DC Voltage VDC5V
Max Input Power15dBm 2000h
Moisture Sensitivity LevelMSL 2

 

 

2-1.Electrical characteristics

AT 25℃±5℃

 

ItemsTest ConditionMinTypMaxUnit
Center Frequency--1575.42-MHz
Insertion LossF0±1.2 MHz-0.91.3dB
Ripple LevelF0±1.2 MHz-0.10.5dB
AttenuationD.C~1425MHz3035-dB
1425~1500MHz3842-dB
1500~1525MHz4247  
1625~1650MHz4043-dB
1650~1725MHz3538  
1725~1850MHz3538-dB
1850~2000MHz3035-dB
2000~3000MHz3035-dB
VSWR1574.22~1576.62MHz-1.21.6-
Input/Output Impedance--50-ohm

 

 

2-2.Typical frequency response

 

5. ENVIRONMENTAL CHARACTERISTICS

5-1 High temperature exposure

Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions

for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.

5-2 Low temperature exposure

Subject the device to -40℃ for 16 hours. Then release the device into the room conditions

for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.

5-3 Temperature cycling

Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high

temperature of +85℃ for 30 Minutes. Then release the device into the room conditions

for 24 hours prior to the measurement. It shall meet the specifications in 2-2.

5-4 Resistance to solder heat

1,immerge the solder bath at 260℃ for 10 sec

2,the iron at 370℃ for 3 sec)

5-5 Solderability )

Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than

95% area of the soldering pad must be covered with new solder. It shall meet the

specifications in 2-2

5-6 Reflow soldering

 

 

 

 

 

 

 

 

 

 

The specimen shall be passed through the reflow furnace with the condition shown in

the above profile for 1 time.

The specimen shall be stored at standard atmospheric conditions for 1h, after which

the measurement shall be made. Test board shall be 1.6 mm thick. Base material shall be

glass fabric base epoxy resin.

5-7 Mechanical shock

Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device

shall fulfill the specifications in 2-2.

5-8 Vibration

Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of

1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2-2.

 

 

6. REMARK

6.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction of

the component. Please avoid static voltage.

6.2 Ultrasonic cleaning

Ultrasonic vibration may cause deterioration & destruction of the component. Please

avoid ultrasonic cleaning

6.3 Soldering

Only leads of component may be solded. Please avoid soldering another part of

component.

7. Packing

7.1 Dimensions

(1) Carrier Tape: Figure 1

(2) Reel: Figure 2

(3) The product shall be packed properly not to be damaged during transportation and storage.

7.2 Reeling Quantity

3000 pcs/reel φ 178mm

10000 pcs/reel φ 259mm

7.3 Taping Structure

(1) The tape shall be wound around the reel in the direction shown below.

 

 

 

 

 

 

 

 

 

 

 

 

 

(2) Label

 

Device Name 
Marking 
User Product Name 
Quantity 
Lot No. 

 

(3) Leader part and vacant position specifications.

 

 

 

 

 

 

 

 

 

 

 

 

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