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SIC Silicon Carbide Wafer 4H - N Type For MOS Device 8inch Dia200mm

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SIC Silicon Carbide Wafer 4H - N Type For MOS Device 8inch Dia200mm

Country/Region china
City & Province shanghai shanghai
Categories Abrasives
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Product Details

 

2inch 4/6inch dia200mm sic seed wafer 1mm thickness for ingot growth High Purity 4 6 8-inch conductive semi-insulation SiC single crystal wafer

Customized size/2inch/3inch/4inch/6inch 6H-N/4H-SEMI/ 4H-N SIC ingots/High purity 4H-N 4inch 6inch dia 150mm silicon carbide single crystal (sic) substrates wafers/ Customzied as-cut sic wafers production 4inch grade 4H-N 1.5mm SIC Wafers for seed crystal 4inch 6inch seed sic wafer 1.0mm Thickness 4h-N SIC Silicon Carbide Wafer For seed growth

Product Description

Product Name
SIC
Polytype
4H
Surface orientation on-axis
0001
Surface orientation off-axis
0± 0.2°
FWHM
≤45arcsec
Type
HPSI
Resistivity
≥1E9ohm·cm
Diameter
99.5~100mm
Thickness
500±25μm
Primary flat orientation
[1-100]± 5°
Primary flat length
32.5± 1.5mm
Secondary flat position
90° CW from primary flat ± 5°, silicon face up
Secondary flat length
18± 1.5mm
TTV
≤5μm
LTV
≤2μm(5mm*5mm)
Bow
-15μm~15μm
Warp
≤20μm
(AFM) Front (Si-face) Roughn
Ra≤0.2nm(5μm*5μm)
Micropipe Density
≤1ea/cm2
Carbon Density
≤1ea/cm2
Hexagonal void
None
Metal impurities
≤5E12atoms/cm2
Front
Si
Surface Finish
CMP Si-face CMP
Particles
size≥0.3μm)
Scratches
≤Diameter (Cumulative Length)
Orange peel/pits/stains/striations/cracks/contaminati on
None
Edge chips/indents/fracture/hex plates
None
Polytype areas
None
Front laser marking
None
Back Finish
C-face CMP
Scratches
≤2*Diameter (Cumulative Length)
Back defects (edge chips/indents)
None
Back roughness
Ra≤0.2nm(5μm*5μm)
Back laser marking
1mm (from top edge)
Edge
Chamfer
Packaging
The inner bag is filled with nitrogen and the outer bag is vacuumed.
Packaging
Multi-wafer cassette, epi-ready.

SiC Applications

SiC single crystal has many excellent properties, such as high thermal conductivity, high saturated electron mobility, strong voltage breakdown resistance, etc., suitable for the preparation of high frequency, high power, high temperature, and radiation-resistant electronic devices.

1--Silicon carbide wafer is mainly used in the production of SCHOttky diode, metal oxide semiconductor field effect transistor,
junction field effect transistor, bipolar junction transistor, thyristor, turn-off thyristor and insulated gate bipolar
transistor.

 

2--SiC power MOSFET devices have ideal gate resistance, high-speed switching performance, low on-resistance, and high stability. It is the preferred device in the field of power devices below 300V. There are reports that a silicon carbide MOSFET with a blocking voltage of 10kV has been successfully developed. Researchers believe that SiC MOSFETs will occupy an advantageous position in the field of 3kV - 5kV.

 

3--SiC power MOSFET devices have ideal gate resistance, high-speed switching performance, low on-resistance, and high stability. It is the preferred device in the field of power devices below 300V. There are reports that a silicon carbide MOSFET with a blocking voltage of 10kV has been successfully developed. Researchers believe that SiC MOSFETs will occupy an advantageous position in the field of 3kV - 5kV.

 

Product Display

SiC ApplicationCatalohue Common Size In our Stock

4H-N Type / High Purity SiC wafer/ingots

2 inch 4H N-Type SiC wafer/ingots
3 inch 4H N-Type SiC wafer
4 inch 4H N-Type SiC wafer/ingots
6 inch 4H N-Type SiC wafer/ingots

4H Semi-insulating / High Purity SiC wafer

2 inch 4H Semi-insulating SiC wafer
3 inch 4H Semi-insulating SiC wafer
4 inch 4H Semi-insulating SiC wafer
6 inch 4H Semi-insulating SiC wafer
 
 
6H N-Type SiC wafer
2 inch 6H N-Type SiC wafer/ingot
 
Customized size for 2-6inch
 


We specialize in processing a variety of materials into wafers, substrates, and customized optical glass parts. components widely used in electronics, optics, optoelectronics, and many other fields. We also have been working closely with many domestic and oversea universities, research institutions, and companies, to provide customized products and services for their R&D projects.
It's our vision to maintain a good cooperation relationship with all our customers through our good reputation.

 

Q: What's the way of shipping and cost?
(1) We accept DHL, Fedex, TNT, UPS, EMS, SF and etc.
(2) If you have your own express account, it's great.
Q: How to pay?
(1) T/T, PayPal, West Union, MoneyGram and
Assurance payment on Alibaba and etc.
(2) Bank Fee: West Union≤USD1000.00),
T/T -: over 1000usd ,please by t/t
Q: What's the deliver time?
(1) For inventory: the delivery time is 5 workdays.
(2) The delivery time is 7 to 25 workdays for customized products. According to the quantity.
Q: Can I customize the products based on my need?
Yes, we can customize the material, specifications, and optical coating for your optical components based on your needs.

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