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Description:
Magnetron sputtering is another form of PVD coating technology.
Plasma coating
Magnetron sputtering is a plasma coating process whereby sputtering
material is ejected due to bombardment of ions to the target
surface. The vacuum chamber of the PVD coating machine is filled
with an inert gas, such as argon. By applying a high voltage, a
glow discharge is created, resulting in acceleration of ions to the
target surface and a plasma coating. The argon-ions will eject
sputtering materials from the target surface (sputtering),
resulting in a sputtered coating layer on the products in front of
the target.
Reactive sputtering
Often an additional gas such as nitrogen or acetylene is used,
which will react with the ejected material (reactive sputtering). A
wide range of sputtered coatings is achievable with this PVD
coating technique. Magnetron sputtering technology is very
advantageous for decretive coating (e.g. Ti, Cr, Zr and Carbon
Nitrides), because of its smooth nature. The same advantage makes
magnetron sputtering widely used for tribological coating in
automotive markets (e.g. CrN, Cr2N and various combinations with DLC coating - Diamond Like Carbon
coating).
Magnetic fields
Magnetron sputtering is somewhat different from general sputtering
technology. The difference is that magnetron sputtering technology
uses magnetic fields to keep the plasma in front of the target,
intensifying the bombardment of ions. A highly dense plasma is the
result of this PVD coating technology.
Magnetron sputtering technology is characterized by:
Maximum Sputtering Power | |
Indirect Cooled target | > 20 Watts / cm2 (DC) |
> 7 Watts / cm2 (RF) | |
Discharge Voltage/ | 100 to 1500 volts |
Discharge Current | > 0.05 amps / cm2 |
Operating Pressure | 0.05 to 5 Pa |
Target utilization | > 35% |
Target | |
Form | Rectangular/ Planar |
Thickness | 6mm~16mm |
Width | 125mm |
Installation | Internal/external |