Gold Magnetron Sputtering coating machine on glass, metal chips, 24K gold PVD deposition System

Copper/Aluminum/Carbon Sputtering Equipment, High Vacuum Magnetron Sputtering Deposition System

• Anti Finger Print Coating
• Plasma Hardening Treatment (PHT)

• UHV Sputtering deposition system uses the sputtering cathodes as the PVD deposition sources. It always comibled MF sputter and DC sputters for indstrial PVD coating applications. Based on different targets and sputtering deposition speed's requests, Royal Technology provides cylidrical sputters and planar sputter cathodes, mainly for fast deposition rates to satisfy industrial production coating demand.

   

   

  High Vacuum Magnetron Sputtering Deposition System is designed for copper, alumunium, plastic, metal circuit board conductive film layer plating. It can condense Nano thin film on substrates. Except Ag sputtering, it can also deposit Ni, Au, Ag, Al, Cr, stainless steel targets.

  It can deposite high uniformity films on various substrates: plastic panle, PC panle, Aluminum sheet, Ceramic sheets, Al2O3 ceramic, AlN, Silicon sheets etc.

   

   

  RTSP1215 Sputtering Coating Equipment Layout

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  RTSP series Sputtering Coating Equipment Applications:

   

  1. Available on substrates of: Plastic, Polymer, Glass and ceramic sheets, Stainless steel, Copper sheet, Aluminum board etc.

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• 2. To generate Nano film like: TiN, TiC, TiCN, Cr, CrC, CrN, Cu, Ag, Au, Ni, Al etc.

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  RT-SP series Sputtering Coating Equipment Design Features:

   

  1. Robust design, good for limited room space

  2. Easy access for maintenance and repair

  3. Fast pumping system for high yield

  4. CE standard electrical enclosure, UL standard is also available.

  5. Accurate fabrication workmanship

  6. Stable running to guarantee high quality film production.

   

   

  Ion source is original from Gencoa company, the properties:

   

  1. Optimized magnetic fields to produce a collimated plasma beam at standard sputtering pressures

  2. Automated regulation for the gas to maintain constant current & voltage – multi-gas auto control

  3. Graphite anode and cathode to protect the substrate from contamination and provide long-life components

  4. RF standard electrical insulation on all ion sources

  5. In-direct cooling of anode and cathode – quick switching of parts

  6. Easy switching of cathode parts to provide multiple magnetic traps for lower voltage operation, or a focused beam

  7. Voltage regulated power supply with gas adjustment feedback to maintain same current at all times

   

   

  High Vacuum Magnetron Sputtering Deposition System Technical Specifications:

   

  MODEL	RT1215-SP
  MATERIAL	Stainless Steel (S304)
  CHAMBER SIZE	Φ1200*1500mm (H)
  CHAMBER TYPE	1-door structure, Vertical
  SINGLE PUMP PACKAGE	Rotary VaneVacuum Pump
  	Roots Vacuum Pump
  	Magnetic Suspension Molecular Pump
  	Two-stage rotary vane vacuum pump
  TECHNOLOGY	MF Magnetron Sputtering, Linear Ion Source
  POWER SUPPLY	Sputtering power supply + Bias Power supply + Ion Source
  DEPOSITION SOURCE	4 pairs MF Sputtering Cathodes + Ion Source + DC sputters
  CONTROL	PLC+Touch Screen
  GAS	Gas Mass Flow Meters ( Ar, N2, C2H2, O2) Argon, Nitrogen and Ethyne,Oxygen
  SAFETY SYSTEM	Numerous safety interlocks to protect operators and equipment
  COOLING	Cooling Water
  CLEANING	Glow Discharge/Ion Source
  POWER MAX.	120KW
  AVERAGE POWER CONSUMPTION	70KW