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25um Thick Electrodeposited ED Copper Foil Roll Anti Oxidation

JIMA Copper

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Address: No.275,Guoding East Road,Yangpu District,Shanghai Municipality

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25um Thick Electrodeposited ED Copper Foil Roll Anti Oxidation

Country/Region china
City & Province shanghai shanghai
Categories Copper Strips
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Product Details

0.025mm Thick ED Copper Foil , Copper Foil 25 micron

 

Advantages
1. Good ductility and strong viscosity. 2. Low surface Oxygen characteristics. 3. Good electrical conductivity and Shielding Effect. 4. Good effectiveness on static discharge after grounding. 5. Excellent adhesion strength and thermal conductivity. 6. Roll or sheet can be customized, custom made size and shape also acceptable.
 
Company Information
 

JIMA has 20 years experience in copper foil industry, more than 27000 tons output yearly to meet the rising market requirement. In PCB, battery and shielding field, our copper foil leads the market as a material supplier. High quality product and sincere service is our fundamental to be existence and developing.

 

Copper Specification
Product name ED Copper Foil 25 Micron, Insulated Copper Foil 0.025mm Thick
Copper foil thickness 25um,0.025mm
Copper typeED Copper Foil for PCB, Li-ion Battery, MRI Room sheilding copper foil ,Insulated
Copper content≥ 99.9%
CertificationISO 9001:2008, IPC-4562, RoHS
MOQOne roll
Cut roll widthCustomized
Coil length and weighton request
CharacteristicsHigh Temperature Elongation, Fine and Uniform Crystal Structure
Payment TermT/T in advance, Western Union, L/C
Flatnessgood flatness close to 100%, without stress or others that can influence the production
Applicationtransformer, PCB, battery, precisio

 

ED Copper Foil Typical Properties 

Classification

 

UnitRequirementTest Method
Foil Designation/HM1IPC-4562A
Nominal thickness/1/2 OZ3/4 OZ1 OZIPC-4562A
Area Weightg/㎡150±5228±8285±10

IPC-TM-650

2.2.12.2

Purity≥99.8

IPC-TM-650

2.3.15

Foil ProfileShiny side (Ra)սm≤0.4≤0.4≤0.4

IPC-TM-650

2.3.17

Matte side(Rz)um≤8≤10≤12
Tensile Strength

R.T.(23℃)

 

Mpa≥220≥235≥280

IPC-TM-650

2.3.18

Elongation

R.T.(23℃)

 

≥2≥3≥3

IPC-TM-650

2.3.18

Peel Strength(FR-4)CEM-1N/mm≥1.5≥1.7≥2.0

IPC-TM-650

2.4.8

PTC≥0.5≥0.6≥0.8
Pinholes&porosityNumberNo

IPC-TM-650

2.1.2

Anti-oxidizationR.T.(23℃)day180 or customize/
H.T.(200℃)Minutes60 or customize/

 

Copper Feature
1. Lightweight
2. Installed in more MRI Sites Worldwide than any other shield system.
3. Can be used with either a monolithic RF Floor (moisture resistance) or a modular RF Floor.
4. Copper Serves as an eddy current shield for EMI Protection

 

The Production Flow :

 

 

Copper Foil Photos 

 

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