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12um 18um 25um 35um ED Copper Foils For FPC Materials / EMI

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12um 18um 25um 35um ED Copper Foils For FPC Materials / EMI

Country/Region china
City & Province shanghai shanghai
Categories Copper Strips
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Product Details

 

ED Copper Foils 12um 18um 25um 35um for FPC Materials & EMI

 

>.   the treatment low profile foil in back/red.

>.  Thickness: 12~35µm

>.  Width: 200-1340mm

>.   Performances:The product surface is black or red, has lower surface roughness.

>.   Applications: Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film. Table1- Performance:

 

Typical properties of Low Profile Copper Foil

ClassificationUnitRequirementTest Method
Nominal thickness/12um1/2 OZ(18um)3/4 OZ(25um)1 OZ(35um)50UM70UM105UMIPC-4562A
Area Weightg/㎡107±4153±5228±8285±10435±15585±20870±30IPC-TM-650 2.2.12.2
Purity≥99.8IPC-TM-650 2.3.15
RoughnessShiny side(Ra)≤0.43≤0.43≤0.43≤0.43≤0.43≤0.43≤0.43IPC-TM-650 2.3.17
Matte side(Rz)um≤4.5≤5.0≤6.0≤7.0≤8.0≤12≤14
Tensile StrengthR.T.(23℃)≥207≥207≥207≥276≥276≥276≥276IPC-TM-650. 2.4.18
H.T.(180℃)Mpa≥138
ElongationR.T.(23℃)≥4≥4≥5≥8≥10≥12≥12IPC-TM-650. 2.3.18
H.T.(180℃)≥4≥4≥5≥6≥8≥8≥8
Peel Strength(FR-4)N/mm0.8≥1.0≥1.1≥1.2≥1.4≥2.0≥2.0IPC-TM-650 2.4.8
Ibs/in4≥4.6≥5.7≥6.3≥7≥8≥11.4≥11.4
Pinholes&porosityNumberNoIPC-TM-650 2.1.2
Anti-oxidizationR.T.(23℃)180 
H.T.(200℃)60 Minutes30 

Low Profile Copper Foil Picture 

 

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