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ED Electrodeposited Copper Foil For Mylar Tape None Pinholes 99.8% Purity

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ED Electrodeposited Copper Foil For Mylar Tape None Pinholes 99.8% Purity

Country/Region china
City & Province shanghai shanghai
Categories Copper Strips
InquireNow

Product Details

HTE electrodeposited ED electrolytic copper foil(High temperature elongation  electrodeposited ED Copper foil)

Features:

1. the treated foil in gray or red

2. High peel strength

3. Good etch ability

4. Excellent adhesion to etching resist

5. Anti foil cracking by high elongation at elevated temperature

6. Eco-friendly products and processes

Application:

1. Polyimide board

2. Epoxy board

 

Typical properties of High temperature elongation copper foil(for epoxy &polyimide board)

Classification

 

UnitRequirementTest Method
Foil Designation/THM123IPC-4562A
Nominal thickness/12um1/2 OZ3/4 OZ

1

OZ

2

OZ

3

OZ

IPC-4562A
Area Weightg/㎡107±4153±5228±8285±10580±15860±20

IPC-TM-650

2.2.12.2

Purity≥99.8

IPC-TM-650

2.3.15

Foil ProfileShiny side (Ra)սm≤0.4≤0.4≤0.4≤0.4≤0.4≤0.4

IPC-TM-650

2.3.17

Matte side(Rz)um≤5≤7≤8≤9≤13≤18
Tensile Strength

R.T.(23℃)

 

Mpa≥150≥220≥235≥280≥280≥280

IPC-TM-650

2.3.18

Elongation

R.T.(23℃)

 

≥4≥4≥4≥5≥5≥5

IPC-TM-650

2.3.18

SubjectΩ.g/㎡≤0.170≤0.166≤0.162≤0.162≤0.162≤0.162

IPC-TM-650

2.5.14

Peel Strength(FR-4)N/mm≥1.0≥1.3≥1.6≥1.6≥2.1≥2.1

IPC-TM-650

2.4.8

Pinholes&porosityNumberNo

IPC-TM-650

2.1.2

Anti-oxidizationR.T.(23℃)day180/
H.T.(200℃)Minutes60/

3. Standard Width,1295(±1)mm,May according to the customer request tailor.

We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.

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