Active Member
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[China]
Address: E602/609,Huafeng creative world, Hangcheng Industrial Park, Xixiang, Baoan Dist., 518100，Shenzhen City, Guangdong Province, China.
Contact name:Lexie
Shenzhen Senyan Circuit Co., Ltd. |
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Welcome to Senyan
Senyan (shenzhen) has always been focusing on the design and
production of high-end circuit boards, providing customers with
professional and efficient one-stop turnkey solutions.
According to the design documents provided by you carry out PCB
manufacturing PCB
Our Advantages&Service
1. PCB assembly Making(Rigid, Flexible, rigid-flexible, Aluminium, High TG,
ceramic),Component Source(We have the good supply chain to ensure quality
with competitive price), SMT&DIP, Free Programe&Test, OEM service.
2. Factory Area: 10000square meters, 400workers, 13 SMT Lines, 5 DIP Lines, 1 X-ray, 13 AOI machines, 2 Sample test machine.
3. Certification : UL, CE, FCC, RoHS, ISO9001, ISO14001, ISO13485, TS16949
4. Quality Control: IPC-A-610E standard, E-test, X-ray, AOI test, IQC, QC, QA, 100% functional test.
5. Quote within 24 Hours.
| 1 | Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc. |
| 2 | Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
| 3 | Surface finish | HASL, OSP, Immersion Silver, Immersion Gold, ENIG, ENEPIG, Immersion Tin |
| 4 | PCB Assembly Max panel size | 1190*350mm/450*450mm |
| 5 | Layer | Samples: 1-64 Layers, Mass production: 2-58 Layers, Flexible PCB: 1-12 Layers |
| 6 | Min.drilled hole size | Machine Drilling 8mil(0.20mm), Laser Drilling 3mil(0.075mm) |
| 7 | PCB Assembly QC | X-ray, AOI Test, Functional Test |
| 8 | Specialty | Gateway, Medical, Security, GPS tracker, Consumer, Automotive electronics |
| 9 | Our service | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB development and design, PCB manufacturing from 1 to 64 layers |
| 10 | Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. |
| 11 | Certificate | RoHS/ISO9001/TS16949/UL/ISO14001/ISO13485 |
1.We are specialized in manufacturing Single-Sided Boards, Double-Sided Boards and multilayer PCB. We are honored as the excellent supplier of many companies all around this world.
2.We can offer all kinds of services including PCB and PCB assembly sample orders and batch orders.We have got the ISO9001:2000, ISO14001, and UL RoHS certifications.
.3.We deeply believe that our good service and experience will completely meet you need. Integrity, value and innovation are the forces that drive our success. We are the smart choice for you and the trusted source at the center of your deal. Welcome the win-win situation together.
SMT Manufacturing Capability | |||
Item | Manufacturing Capability in process | Manufacturing Method | |
Production size(Min/Max) | 50×50mm / 500×500mm | ||
Production board thickness | 0.2 ～ 4mm | ||
Printing solder paste | Support method | Magnetism fixture, vacuo platform | |
Sticking up by vacuo, clamping on both sides ,flexible clamping
with sheet, flexible clamping with thick board | |||
Cleaning Method of printing solder paste | Dry method+ wetting method+ Vacuo method | ||
Accuracy of printing | ±0.025mm | ||
SPI | Repeated accuracy of volume | <1% at 3σ | |
Mounting component | Components size | 0603(Option) L75mm Connector | |
Pitch | 0.15mm | ||
Repeated accuracy | ±0.01mm | ||
AOI | FOV size | 61×45mm | |
Test speed | 9150mm²/Sec | ||
3D X-ray | Shootingangle | 0-45 | |
Rigid RPCB Manufacturing Capability | ||
Item | RPCB | HDI |
minimum linewidth/linespacing | 3MIL/3MIL(0.075mm) | 2MIL/2MIL(0.05MM) |
minimum hole diameter | 6MIL(0.15MM) | 6MIL(0.15MM) |
minimum solder resist opening (single-side) | 1.5MIL(0.0375MM) | 1.2MIL(0.03MM) |
minimum solder resist bridge | 3MIL(0.075MM) | 2.2MIL(0.055MM) |
maximum aspect Ratio (thickness/hole diameter) | 10:1 | 8:1 |
impedance control accuracy | +/-8% | +/-8% |
finished thickness | 0.3-3.2MM | 0.2-3.2MM |
maximum board size | 630MM*620MM | 620MM*544MM |
maximum finished copper thickness | 6OZ(210UM) | 2OZ(70UM) |
minimum board thickness | 6MIL(0.15MM) | 3MIL(0.076MM) |
maximum layer | 14层 | 12层 |
Surface treatment | HASL-LF,OSP ,Immersion Gold, Immersion Tin ,Immersion Ag | Immersion Gold,OSP,selectiveimmersion gold, carbon print |
Min/max laser hole size | / | 3MIL / 9.8MIL |
laser hole size tolerance | / | 10% |
