NCSU033CT UV SMD LED 365nm 750mW at 500mA 1.9W with Star PCB High Power LEDs

The Nichia NCSU033C UV SMD LED 750mW, 365nm, impresses with outstanding performance

and strong efficiency in specialised applications. Manufactured by LUMITRONIX, your expert for

LED lighting solutions, this model meets high demands

The technical highlights of the Nichia NCSU033C

This LED is characterised above all by its high performance and can be used extremely flexibly thanks

to its compact dimensions and lightweight housing. Its UV wavelength of 365 nm and an irradiance of

750 mW make the NCSU033C from Nichia the ideal choice for specialised industrial applications.

• Product feature: High-power UV LED
• Packaging: 033 Package
• Base: on star board
• Light colour: 365 nm (UV-A)
• Power: 750 mW
• Risk group: 3 (EN 62471)
• Dimensions LED (L x W x H): 6.8 x 6.8 x 1.93 mm

Application areas of the Nichia NCSU033C

The UV SMD LED is particularly suitable in the following areas:

• Medical technology: in devices and equipment
• Testing and sorting equipment: for improved accuracy
• Curing: ideal for UV-based curing processes
• UV light cameras: for specific imaging

A word of caution

The NCSU033C UV LED emits invisible light that can be hazardous to the eye when exposed for

short periods of time. For this reason, it is intended exclusively for use in the industrial sector.

Nichia - The pioneer in LED technology

As the world's largest LED manufacturer and inventor of the blue (and therefore also the white)

light-emitting diode, Nichia sets standards in terms of efficiency, brightness and service life. With

an innovative research department that regularly sets new records, Nichia is synonymous with

quality and performance. As an official distributor of Nichia, LUMITRONIX offers the best possible

conditions and especially attractive prices.

This LED is designed to be reflow soldered on to a PCB. If dip so1dered or hand soldered, Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* When the LEDs are cooled from the peak reflow temperature, ensure that the coo1ing is performed very gradua1ly to avoid
excessive stress on the LED (e.g. causing cracks in the solder joints). Ensure that sufficient preliminary verification is performed
to ensure that there are no issues with the chosen reflow soldering conditions/ process.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or
atmosphere.
Repairing should not be done after the LEDs have been soldered. It should be confirmed beforehand whether the characteristics
of the LEDs will or will not be damaged by repairing.
* The Die Heat Sink should be soldered to customer PCB. If it is difficu1t or impossible, use high heat-dissipating adhesive.
* When soldering; do not apply stress to the LED while the LED is hot.
* When using a pick and place machine, choose an appropriate nozz1e for this product.
* The recommended so1dering pad pattern is designed for attachment of the LED without prob1ems. When precise mounting
   accuracy is required, such as high-density mounting. ensure that the size and shape of the pad are suitable for the circuit design.
   When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the
   flux will come in contact with the LEDs.
* Make sure that there are no issues with the type and amount of solder that is being used.