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[China]
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Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact name:Ivy Deng
Bicheng Electronics Technology Co., Ltd |
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High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
S1000-2M is a type of High Tg printed circuit board material manufactured by Shengyi with characteristics of high performance and low CTE, suitable for high multilayer PCB. The thickness ranges 0.05mm to 3.2mm, copper weight 0.5oz to 3oz etc.
Features
Lead-free compatible FR-4 laminate
Tg170℃ (DSC), UV Blocking/AOI compatible
High heat resistance
Lower Z-axis CTE
Excellent through-hole reliability
Excellent Anti-CAF performance
Low water absorption
Excellent mechanical processability
Applications
Computer
Communication
Automotive electronics
Suitable for high layer count PCB
Our PCB Capability (S1000-2M)
| PCB Material: | High Tg, High Performance and Low CTE Epoxy Resin |
| Designation: | S1000-2M |
| Dielectric constant: | 4.6 at 10GHz |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| PCB thickness: | 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
General Properties of S1000-2M
| Test Items | Test Method | Test Condition | Unit | Typical Value |
| Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 |
| IPC-TM-650 2.4.25D | DSC | ℃ | 180 | |
| Td | IPC-TM-650 2.4.24.6 | TGA (5% W.L) | ℃ | 355 |
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 |
| T300 | IPC-TM-650 2.4.24.1 | TMA | min | 15 |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 41 |
| IPC-TM-650 2.4.24 | After Tg | ppm/℃ | 208 | |
| IPC-TM-650 2.4.24 | 50-260℃ | % | 2.4 | |
| Permittivity (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | - | 4.6 |
| Loss Tangent (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | - | 0.018 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ-cm | 8.7×108 |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 2.2×107 |
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-0.5/23 | s | 133 |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-0.5/23 | kV | >45 |
| Peel Strength (1oz) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm [lb/in] | 1.3 [7.43] |
| Flexural Strength (LW/CW) | IPC-TM-650 2.4.4 | A | Mpa | 567/442 |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.08 |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 |
| CTI | IEC60112 | A | Rating | PLC 3 |
