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Rogers PCB Built on Kappa 438 20mil 0.508mm DK 4.38 with Immersion Gold for Carrier Grade WiFi
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible.
Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.
Features
1. Dk of 4.38 is tailored to FR-4 industry standard norms
2. Tighter Dk and thickness tolerance than FR-4
3. High Tg of > 280°C TMA
Benefits
1. Ease of PCB manufacturing and assembly in Line with FR-4
2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance
3. Consistent circuit performance
4. Improved design flexibility and plated through-hole reliability
5. Automated assembly compatible
Typical Applications:
1. Carrier Grade WiFi/Licensed Assisted Access (LAA)
2. Small Cell and Distributed Antenna Systems (DAS)
3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)
4. Internet of Things (IoT)
Segments: Smart Home and Wireless Meters
Our PCB Capability (Kappa 438)
| PCB Material: | Glass Reinforced Hydrocarbon Ceramic |
| Designation: | Kappa 438 |
| Dielectric constant: | 4.38 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| PCB thickness: | 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of Kappa 438 Laminate
| Property | Typical Value Kappa 438 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Design | 4.38 | Z | - | 2.5 GHz | Differential Phase Length Method |
| Dissipation Factor tan, d | 0.005 | Z | - | 10 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant e | -21 | - | ppm/°C | 10 GHz (-50 to 150°C) | Modified IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2.9 x 109 | - | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 6.2 x 107 | - | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 675 | Z | V/mil | - | IPC-TM-650 2.5.6.2 |
| Tensile Strength | 16 12 | MD CMD | kpsi | - | ASTM D3039/D3039-14 |
| Flexural Strength | 25 19 | MD CMD | kpsi | - | IPC-TM-650 2.4.4 |
| Dimensional Stability | -0.48-0.59 | MD CMD | mm/m | - | IPC-TM-650 2.4.39a |
| Coefficient of Thermal Expansion | 13 | X | ppm/°C | -55 to 288°C | IPC-TM-650 2.4.41 |
| 16 | Y | ||||
| 42 | Z | ||||
| Thermal Conductivity | 0.64 | Z | W/(m.K) | 80°C | ASTM D5470 |
| Time to Delamination (T288) | >60 | - | minutes | 288°C | IPC-TM-650 2.4.24.1 |
| Tg | >280 | - | °C TMA | - | IPC-TM-650 2.4.24.3 |
| Td | 414 | - | °C | - | IPC-TM-650 2.3.40 |
| Moisture Absorption | 0.07 | - | % | 24/23 | IPC-TM-650 2.6.2.1 |
| Young’s Modulus | 2264 2098 | MD CMD | kpsi | - | ASTM D3039/D3039-14 |
| Flex Modulus | 2337 2123 | MD CMD | kpsi | - | IPC-TM-650 2.4.4 |
| Bow | 0.03 | - | % | - | IPC-TM-650 2.4.22C |
| Twist | 0.08 | - | % | - | IPC-TM-650 2.4.22C |
| Copper Peel Strength After Thermal Stress | 5.8 | - | lbs/in | 1 oz (35 µm) foil | IPC-TM-650 2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Specific Gravity | 1.99 | - | g/cm3 | - | ASTM D792 |
| Lead-Free Process Compatible | Yes | - | - | - |
