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2.0mm Automotive Printed Circuit Board Double Sided CTI 600 PCB

Bicheng Electronics Technology Co., Ltd

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2.0mm Automotive Printed Circuit Board Double Sided CTI 600 PCB

Country/Region china
City & Province shenzhen guangdong
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Product Details

 

High CTI 600V PCB Built on 2.0mm FR-4 With HASL and Countersunk Holes

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Introduction

This is a type of single sided circuit board built on FR-4 substrate with CTI 600V. It is a 2.0mm thick PCB with simple tracks, green solder mask and white silkscreen. The surface finish on pads is hot air leveling, lead free type. There are 3 countersunk holes aligned on a track. The panel contains 12 individual boards.

 

PCB Specifications

ItemDescriptionValue
1. LaminateMaterial TypeFR-4 CTI 600V
Tg135
SupplierKB
Thickness1.9-2.0mm
2.Plating thicknessHole Wall/
Outer copper41.09µm
Inner Copper/
3.Solder maskMaterial TypeTAIYO/ PSR-2000GT600D
ColorGreen
Rigidity (Pencil Test)5H
S/M Thickness20.11µm
LocationBoth Sides
4. Component MarkMaterial TypeIJR-4000 MW300
ColorWhite
LocationC/S
6. IdentificationUL MarkYES
Date Code2121
Mark LocationSolder Side
7. Surface FinishMethodHASL Lead free
Tin Thickness6.57µm
8. NormativenessRoHSOK
REACHOK
9.Annular RingMin. Line Width (mil)4.8mil
Min. Spacing (mil)5.2mil
12. FunctionElectrical Test100% PASS
13. AppearanceIPC Class LevelIPC-A-600J &6012D Class 2
Visual InspectionIPC-A-600J &6012D Class 2
Warp and Twist0.21%
14. Reliability TestTape TestNo Peeling
Solvent TestNo Peeling
Solderability Test265 ±5
Thermal Stress Test288 ±5
Ionic Contamination Test0.56µg/c

 

Applications

PDP, LCD , TV

Refrigerator

Power supplier

Washing machine

 

What is Comparative Tracking Index (CTI)?

Here CTI is a quality item that refers to copper clad laminate which is widely used in home electrical appliance or other high-voltage (110V, 220V) electrical apparatus.It is a simulated condition that the PCB is polluted in its working environment, which result in leakage or short-circuit at the track gap of the PCB surface, being accompanied by heat releasing and charring.

 

 

The way of experiment is that continous 50 drops of 0.1% ammonium chloride solution are dropped between two points on the PCB surface,30 seconds per drop,turning on high voltage AC current to do the test. Firstly trying 300V to generate 1A current. There's ammonium chloride solution on the surface, so after current is switched on it will produce resistance who also bring out heat, then the solution is slowly evaporated. 2nd drop is on and till to 50 drops to see if the PCB has leakage or not. Once the PCB has 0.1A creepage and exceeds 0.5 seconds, it's judged Failure.

 

The quality of CTI of laminate refers to the externally applied voltage value and without failure of 50 drops. If abovementioned 300V passed, we can increase the voltage to 400V, 500V or 600V till to the high value before failure, that is the data of the laminite CTI.

Bicheng offers high CTI PCB's (high CTI 600V FR-4 and aluminum backed material) which is working in such harsh environment of high voltage, filth and humidity.

 

IEC 112 standard has 3 degrees as follows

Comparative Tracking Index (in Volts)Class
600 <= CTII
400 <= CTI < 600II
175 <= CTI < 400IIIA
100 <= CTI < 175IIIB

 

As per the standard of IEC,the smaller a substrate of CTI grade, the better resistance to tracking. Normal FR-4 ranges 175-225V

 

Data Sheet of FR-4 with CTI 600V

Test ItemsTest MethodTest ConditionUnitTypical Value
TgIPC-TM-650 2.4.25DDSC135
TdIPC-TM-650 2.4.24.6TGA (5% W.L)310
T288IPC-TM-650 2.4.24.1TMAmin2
T260IPC-TM-650 2.4.24.1TMAmin15
Thermal StressIPC-TM-650 2.4.13.1288,solder dips>100
 IPC-TM-650 2.4.24Before Tgppm/55
CTE(Z-axis)IPC-TM-650 2.4.24After Tgppm/308
 IPC-TM-650 2.4.2450-260%4.5
Permittivity (1GHz)IPC-TM-650 2.5.5.9C-24/23/50-4.5
Loss Tangent (1GHZ)IPC-TM-650 2.5.5.9C-24/23/50-0.017
Volume ResistivityIPC-TM-650 2.5.17.1C-96/35/90-cm5.0x108
Surface ResistivityIPC-TM-650 2.5.17.1C-96/35/905.0x107
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-0.5/23s126
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-0.5/23kV>45
Peel Strength (1oz)IPC-TM-650 2.4.8288/10sN/mm [lb/in]1.8 [10.28]
Flexural Strength (LW/CW)IPC-TM-650 2.4.4AMpa550/450
Water AbsorptionIPC-TM-650 2.6.2.1D-24/23%0.1
FlammabilityUL94C-48/23/50RatingV-0
CTIIEC60112ARatingPLC 0 (>600V)

 

Bicheng PCB Capability (FR-4) 2022

ParameterValue
 Layer Counts 1-32
 Substrate MaterialFR-4 inclusive of Tg135, Tg150, High Tg 170, High CTI>600V etc.
 Maximum Size Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance ±0.0059" (0.15mm)
 PCB Thickness0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) ±8%
Thickness Tolerance(t<0.8mm) ±10%
 Insulation Layer Thickness0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track0.003" (0.075mm)
 Minimum Space 0.003" (0.075mm)
 Outer Copper Thickness 35µm--420µm (1oz-12oz)
 Inner Copper Thickness 17µm--420µm (0.5oz - 12oz)
 Drill Hole(Mechanical)0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical)0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)0.00295" (0.075mm)
 Registration (Mechanical)0.00197" (0.05mm)
 Aspect Ratio 12:1
 Solder Mask Type LPI
 Min Soldermask Bridge0.00315" (0.08mm)
 Min Soldermask Clearance0.00197" (0.05mm)
 Plug via Diameter0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance ±10%
 Surface FinishHASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

 

 

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