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Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil

Bicheng Electronics Technology Co., Ltd

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Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103

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Through hole Stencil For PCB Assembly Electro Polishing Solder Paste Stencil

Country/Region china
City & Province shenzhen guangdong
Categories Offset Paper
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Product Details

 

SMT Stencil For PCB Assembly Solder Paste Laser Profile
 
1.1 General description
This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area locating in the center. Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed for shipment.
 
1.2 Features and benifits
The data file is used directly to produce and reduce the error rate;
The opening position accuracy of SMT template is very high: the whole process error is ≤ ±4 μ m;
The opening of SMT template has geometric figure, which is advantageous to the printing and forming of tin paste;
Engineering design prevents problems from occurring in pre production;
Money-saving, Worry-saving and Labor-saving;
Door to door shipment service;
More than 9000 types per month;
No minimum order quantity. 1 piece is available;
 
 
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
 
1.4 Parameter and data sheet
Dimension:370mm x 470mm, 420mm x 520mm, 550mm x 650mm
StructureStencil foils with aluminum frame
Base materialStainless steel shim
Foil Thickness0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm
Aperture configuredLaser cut
AppearanceEngraving and electro polishing
Fiducial markThrough hole
Service area:Worldwide
Quantity of open pads:1533
Advantages:a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother.
Application:CSP, BGA, 0.5mm QFP etc. package
 
1.5 Opening Holes Designs for SMT Stencil
Component TypePitchSoldering WidthSoldering LengthOpening WidthOpening LengthShim Thickness
PLCC1.27mm0.65mm2.00mm0.60mm1.95mm0.15-0.25mm
QFP0.635mm0.35mm1.50mm0.32mm1.45mm0.15-0.18mm
QFP0.50mm0.254-0.33mm1.25mm0.22-0.25mm1.20mm0.12-0.15mm
QFP0.40mm0.25mm1.25mm0.20mm1.20mm0.10-0.12mm
QFP0.30mm0.20mm1.00mm0.15mm0.95mm0.07-0.12mm
0402 0.50mm0.65mm0.45mm0.60mm0.12-0.15mm
0201 0.25mm0.40mm0.23mm0.35mm0.07-0.12mm
BGA1.27mm0.80mm 0.75mm0.75mm0.15-0.20mm
BGA1.00mm0.38mm 0.35mm0.35mm0.10-0.12mm
BGA0.50mm0.30mm 0.28mm0.28mm0.07-0.12mm
Flip Chip0.25mm0.12mm0.12mm0.12mm0.12mm0.08-0.10mm
Flip Chip0.20mm0.10mm0.10mm0.10mm0.10mm0.05-0.10mm

 

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