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6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking

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Contact name:Ivy Deng

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6 Layer Ultrathin 0.6mm Automotive Printed Circuit Board for GPS Tracking

Country/Region	china
City & Province	shenzhen guangdong
Categories	Advertising Screens

Product Details

Via Filled PCB Via in Pad Circuit Board 0.6mm Multilayer PCB Built On 6 Layer With Blind Via for GPS Tracking

1.1 General description

This is a type of 6 layer ultrathin printed circuit board built on FR-4 substrate with Tg 135°C for the application of GPS Tracking. It's only 0.6 mm thick without silkscreen on green solder mask (Taiyo) and immersion gold on pads. The base material is from Taiwan ITEQ supplying 1 up PCB per panel. Vias with 0.25mm are resin filled and capped (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 50 panels are packed for shipment.

1.2 Features and benifits

RoHS compliant and suitable for thermal reliability needs

High solderability, no stressing of circuit boards and less contamination of PCB surface.

Comprehensive equipment management and maintenance and process control

Products and Manufacturing are certified by authorized organizations.

Small quantity order is accepted

Delivery on time: >98%

1.3 Applications

Led Lighting

Intercom System

Portable WiFi Router

GSM Tracker

Commercial Led Lighting

Modem WiFi 4G

Honeywell Access Control

Electronic Access Control

Audio Frequency Amplifier

File servers

1.4 Parameter and data sheet

PCB SIZE	100 x 103mm=1PCS
BOARD TYPE	Multilayer PCB
Number of Layers	6 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 18um(0.5oz)+plate TOP CS
	4mil prepreg
	copper ------- 18um(0.5oz) GND Plane
	4mil FR-4
	copper ------- 18um(0.5oz) PWR Plane
	4mil prepreg
	copper ------- 18um(0.5oz) PWR Plane
	4mil FR-4
	copper ------- 18um(0.5oz) SIG
	4mil prepreg
	copper ------- 18um(0.5oz) BOT PS
TECHNOLOGY
Minimum Trace and Space:	3mil/3mil
Minimum / Maximum Holes:	0.22/3.50mm
Number of Different Holes:	25
Number of Drill Holes:	2315
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT140 TG>135, er<5.4
Final foil external:	1oz
Final foil internal:	0.5oz
Final height of PCB:	0.6mm ±0.1
PLATING AND COATING
Surface Finish	Immersion gold 0.025µm over 3µm Nickel (14.4% area)
Solder Mask Apply To:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Green, TAIYO PSR-2000 GT600D
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	No silkscreen requried.
Colour of Component Legend	No silkscreen requried.
Manufacturer Name or Logo:	No silkscreen requried.
VIA	Plated through hole(PTH), Blind via and via capping on CS and PS, vias not be visible.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

1.5 Design For Manufacture (2)

Serial NO.	Procedure	Item	Manufacturing capability
			Large volume (S<100 m²)	Middle volume (S<10 m²)	Prototype(S<1m²)
			Large volume (S<100 m²)	Middle volume (S<10 m²)	Prototype(S<1m²)
14	Laminating	Tolerance of laminate thickness	±10% PCB thick	±10% PCB thick	±8% PCB thick
15		Maximum laminate thickness	4.0mm	6.0mm	7.0mm
16		Laminate alignment accuracy	≤±5 mil	≤±4 mil	≤±4 mil
17	Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.drill bit diameter	0.2 mm	0.2 mm	0.2 mm
18		Min.slot router diameter	0.60 mm	0.60 mm	0.60 mm
19		Min.tolerance of PTH slots	±0.15mm	±0.15mm	±0.1mm
20		Max.aspect ratio	1:08	1:12	1:12
21		Hole tolerance	±3mil	±3mil	±3mil
22		Space of via to via	6mil(same net),12mil(different net)	6mil(same net),14mil(different net)	4mil(same net),12mil(different net)
23		Space of component hole to component hole	12mil(same net),16mil(different net)	12mil(same net),16mil(different net)	10mil(same net),14mil(different net)
24	Etching	Min.width of etching logo	10mil(18um),12 mil (35um),12 mil(70um)	8mil(18um),10mil(35um),12 mil(70um)	6mil(18um),8 mil(35um),12mil(70um)
25	Etching	Etch factor	1.6-2.2	1.6-2.2	1.6-2.2
26	Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.via pad diameter	20mil	16mil	16mil
27		Min.BGA pad diameter	12mil	12mil	10mil
28		Min.track and spacing	5/5mil(18um)	4/4mil(18um)	3/3.5mil(18um)
			5/5mil(35um)	4/4mil(35um)	3/4mil(35um)
			7/9mil(70um)	6/8mil(70um)	6/7mil(70um)
			9/11mil(105um)	8/10mil(105um)	8/9mil(105um)
			13/13mil(140um)	12/12mil(140um)	12/11mil(140um)
29		Minimum grid	10/10mil(35um)	8/8mil(35um)	4/8mil(35um)
30		Min.space (conductor to pad, pad to pad)	6mil(18um)	5mil(18um)	4mil(18um)
			6mil(35um)	5mil(35um)	4mil(35um)
			9mil(70um)	8mil(70um)	7mil(70um)
			11mil(105um)	10mil(105um)	9mil(105um)
			13mil(140um)	12mil(140um)	11mil(140um)