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[China]
Trade Verify
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact name:Ivy Deng
Bicheng Electronics Technology Co., Ltd |
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Verified Suppliers
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| Number of Layers | 6 |
| Board Type | Multi-layer PCB |
| Board size | 54.99 x 87.50mm=1UP |
| Board Thickness | 1.6mm +/-0.16 |
| Board Material | FR-4 |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 170℃ |
| PTH Cu thickness | ≥20 um (See hole wall details) |
| Inner Iayer Cu thicknes | 35 um (1oz) |
| Surface Cu thickness | 35 um (1oz) |
| Solder Mask Type and Model No. | LPSM, PSR-2000GT600D |
| Solder Mask Supplier | TAiYO |
| Solder Mask Colour | Green |
| Number of Solder Masks | 2 |
| Thickness of Solder Mask | 13um |
| Type of Silkscreen Ink | TAIYO, IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Mininum Trace (mil) | 7 mil |
| Minimum Gap(mil) | 4.9 mil |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Warpage | 0.25% |
| Drill table (mm) | |
| T1 | 1.000 |
| T2 | 3.175 |
| Thermal Shock Test | Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5℃,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
| Drill table (mm) | T1: 0.600 |
| T2: 0.700 | |
| T3:0.800 | |
| T4: 1.000 | |
| T5: 1.100 | |
| T6: 1.250 | |
| T7: 1.850 | |
| T8: 4.000 | |
| T9: 4.325 | |
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume (S<100 m²) | Middle volume (S<10 m²) | Prototype(S<1m²) | |||
| 1 | Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.isolation of layers | 0.1mm | 0.1mm | 0.06mm |
| 2 | Min.track and spacing | 5/5mil(18um) | 4/4mil(18um) | 3/3.5mil(18um) | |
| 3 | 5/5mil(35um) | 4/4mil(35um) | 3/4mil(35um) | ||
| 4 | 7/9mil(70um) | 6/8mil(70um) | 6/7mil(70um) | ||
| 5 | 9/11mil(105um) | 8/10mil(105um) | 8/9mil(105um) | ||
| 6 | 13/13mil(140um) | 12/12mil(140um) | 12/11mil(140um) | ||
| 7 | Min.distance from drill to conductor | 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil | 4 layer 8mil,6 layer 8mil,8-12 layer 10mil,14-20 layer 14mil,22-32 layer 18mil | 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil | |
| 8 | Min.width of annular ring on inner layer | 4 Layer 10mil(35um),≥6 Layer 14mil(35um) | 4 Layer 8mil(35um),≥6 layer 12mil(35um) | 4 Layer 6mil(35um),≥6 Layer 10mil(35um) | |
| 9 | Inner layer isolation ring width(Min) | 10mil (35um) | 8mil (35um) | 6mil (35um) | |
| 10 | Min.via pad diameter | 20mil (35um) | 16mil (35um) | 16mil (35um) | |
| 11 | Min. distance from board edge to conductor(no copper exposured)(inner layer) | 14 mil(35um) | 12 mil(35um)) | 8 mil(35um) | |
| 12 | Maximum copper weight(Inner layer and outer layer) | 3 OZ( 105 um ) | 4 OZ ( 140 um ) | 6 OZ( 210 um ) | |
| 13 | Core with different copper foil on both sides | / | 18/35,35/70 um | 18/35,35/70 um | |
