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[China]
Trade Verify
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact name:Ivy Deng
Bicheng Electronics Technology Co., Ltd |
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Verified Suppliers
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Thin PCB 0.2mm FR-4 Printed Circuit Board with White Solder Mask and OSP
(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)
General Description
This is a type of thin PCB as thin as 0.2mm, it’s made on conventional FR-4 substrate with single layer copper, 1oz copper finished. It’s a very simple board with white solder mask and OSP on pads.
Specifications
| PCB SIZE | 256 x 66mm=1PCS |
| Base Material: | FR-4 |
| Number of Layers | Single sided PCB |
| SMT | YES |
| Through Hole Components | no |
| LAYER STACKUP | Copper ------- 35um(1oz) |
| FR-4 | |
| Minimum Trace and Space: | 59mil/59mil |
| Minimum / Maximum Holes: | 0.5mm/ 5.8mm |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 0.22mm |
| Surface Finish | OSP |
| Solder Mask Apply To: | TOP |
| Solder Mask Color: | White solder mask |
| CONTOUR/CUTTING | Punching |
| Side of Component Legend | TOP |
| Colour of Component Legend | Blue silkscreen |
| VIA | None Plated Through Hole(NPTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Typical Applications
Security Electronics
Program Logic Control
Industrial Systems
Car Tracking Systems
Electronic Counter
External WiFi Antenna
Our Advantages
Engineering design prevents problems from occurring in pre-production;
PCB manufacturing is strictly as per required specifications;
Strict WIP inspection and monitoring as well as working instruction;
Powerful PCB capabilities support your research and development, sales and marketing;
Delivery on time higher than 98% on-time-delivery rate;
30000㎡ output capability per month;
Delivery on time higher than 98% on-time-delivery rate;
Our Capabilities 2022
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
FR-4 Material Description
Today, FR-4 is still the workhorse of the PCB fabrication industry, a material based on an epoxy resin system. It begins to soften at a temperature of 130°C (glass transition temperature, Tg) and exhibits a high expansion in the Z-axis direction when heated above the Tg temperature.
FR-4 (or FR4) is a kind of material grade designation, which means that the resin material is flame resistant (self-extinguishing). FR-4 is a kind of material specifications, not a material name, but a material grade. "FR" stands for flame retardant, and denotes that safety of flammability of FR-4 is in compliance with the standard UL94V-0.
FR-4 glass epoxy is a popular and versatile high-pressure thermoset plastic laminate with good strength to weight ratios. With near zero water absorption, FR-4 is most commonly used as an electrical insulator possessing considerable mechanical strength. The material is also known to retain its high mechanical values and electrical insulating qualities in both dry and humid conditions. These attributes, along with good fabrication characteristics, lend utility to this grade for a wide variety of electrical and mechanical applications.
Laminates --- FR-4 Applied on printed circuit boards (PCBs)
FR-4 grade materials are generally used on the circuit board has many types, but most are based on the so-called four function (Tera-Function) composite material which is composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant.
FR-4 is the primary insulating backbone upon which the vast majority of rigid printed circuit boards (PCBs) are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates (CCL).
FR-4 copper-clad sheets are fabricated with circuitry interconnections etched into copper layers to produce printed circuit boards (PCBs). More sophisticated and complex FR-4 printed circuit boards (PCBs) are produced in multiple layers, also known as "multilayer circuitry".
