Dual Layer Flexible Printed Circuit Board FPCB on Polyimide with Immersion Gold and Impedance control for USB Connector

Dual Layer Flexible Printed Circuit Board FPCB on Polyimide with Immersion Gold and Impedance control for USB Connector

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

General description

This is a type of flexible PCB built on polyimide 76 micron substrate with 90 ohm impedance controlled on 0.15mm/0.3mm track and gap for the application of USB Connector. It's standard 0.20 mm thick with yellow solder mask (coverlay) on both sides and immersion gold are on pads. FR-4 as stiffener is on the head and tail. The base material is used from Shengyi, entire board supplying 1 up flex per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 pieces are packed for shipment.

Parameter and data sheet

Features and benefits

Excellent flexibility;

Reducing the volume;

Weight reduction;

Consistency of assembly;

Increased reliability;

Powerful PCB capabilities support your research and development, sales and marketing;

Delivery on time with higher than 98% on-time-delivery rate;

Team with passion, discipline, responsibility and honesty;

No minimum order quantity. 1 piece is available;

Applications

Flexible flat cable, Industrial control temperature controller soft board, medical equipment controller, automobile GPS navigation flex board, tablet keypad flex board, display backlight

Structure of FPC

According to the number of layers of conductive copper foil, FPC can be divided into single layer circuit, double layer circuit, multi-layer circuit, double sided and so on.

Single-layer structure: the flexible circuit of this structure is the simplest structure of the flexible PCB. Usually the base material (dielectric substrates) + transparent rubber(adhesive) + copper foil is a set of purchased raw materials(semi-manufactures), the protective film and transparent glue are another kind of bought raw material. First, copper foil must be etched to obtain the required circuit, and the protective film should be drilled to reveal the corresponding pad. After cleaning, the two are combined by rolling. Then the exposed part of the pad electroplated gold or tin to protect. In this way, the big panel board will be ready. Generally also it’s stamped into the corresponding shape of the small circuit board. There is also no protective film directly on the copper foil, but printed resistance soldering coating, so that the cost will be lower, but the mechanical strength of the circuit board will become worse. Unless the strength requirement is not high and the price needs to be as low as possible, it is best to apply the protective film method.

Double layer structure: when the circuit is too complex to be wired, or copper foil is needed to shield the ground, it is necessary to choose a double layer or even a multilayer. The most typical difference between a multilayer and a single plate is the addition of a perforated structure to connect the layers of copper foil. The first process of transparent rubber + base material + copper foil is to make holes. Drill holes in the base material and copper foil first, clean and then plated with a certain thickness of copper. The subsequent fabrication process is almost the same as the single-layer circuit.

Double sided structure: both sides of the double sided FPC have pads, mainly used to connect other circuit boards. Although it and monolayer structure is similar, but the manufacturing process is very different. Its raw material is copper foil, protective film and transparent glue. The protective film should be drilled according to the position of the pad first, then the copper foil should be affixed, the pad and track lines should be etched and then the protective film of another drilled hole should be affixed.