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RF-35TC 35um Copper 132x58mm Dual Layer PCB High Thermal Conductivity

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RF-35TC 35um Copper 132x58mm Dual Layer PCB High Thermal Conductivity

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
InquireNow

Product Details

 

Taconic High Frequency PCB Built on RF-35TC 60mil 1.524mm With Immersion Gold for Satellites

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RF-35TC is a type of high frequency material from Taconic company. It offers a "best in class" low dissipation factor with high thermal conductivity. This material is best suited for high power applications where every 1/10th of a dB is critical and the PCB substrate is expected to diffuse heat away from both transmission lines and surface mount components such as transistors.

 

RF-35TC is a PTFE based, ceramic filled fiberglass substrate. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors.

 

This laminate has a low dielectric constant value of 3.50 and has extremely low Df of 0.0011. It provides a low dissipation factor with high thermal conductivity and bonds very well to low profile copper, further reducing insertion loss.

 

The RF-35TC laminates are ideal for antennas, satellites, filters, couplers and power amplifiers.

 

PCB Specifications

PCB SIZE132 x 58mm=1PCS
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 35um(1 oz)+plate TOP layer
RF-35TC 1.524mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY 
Minimum Trace and Space:7 mil / 7 mil
Minimum / Maximum Holes:N/A
Number of Different Holes:N/A
Number of Drill Holes:N/A
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL 
Glass Epoxy:RF-35TC 1.524mm
Final foil external:1.5 oz
Final foil internal:N/A
Final height of PCB:1.6 mm ±10%
PLATING AND COATING 
Surface FinishImmersion gold
Solder Mask Apply To:Bottom, 12micron Minimum
Solder Mask Color:Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendBottom
Colour of Component LegendWhite, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIAN/A
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

 

Data Sheet of RF-35TC

RF-35TC TYPICAL VALUES
PropertyTest MethodUnitValueUnitValue
DK @10 GHzIPC-650 2.5.5.5.1(modified) 3.5 3.5
Tck(-30 to 120℃)IPC-650 2.5.5.5.1(modified)ppm24ppm24
Df @10 GHzIPC-650 2.5.5.5.1(modified) 0.0011 0.0011
Dielectric BreakdownIPC-650 2.5.6(in-Plane,Two Pins in Oil)kV56.7kV56.7
Dielectric StrengthASTM D 149(Through Plane)V/mil570V/mm22,441
Arc ResistanceIPC-650 2.5.1Seconds304Seconds304
Moisture AbsorptionIPC-650 2.6.2.1%0.05%0.05
Flexural Strength(MD)ASTM D 790/IPC-650 2.4.4psi12,900N/mm288.94
Flexural Strength(CD)ASTM D 790/IPC-650 2.4.4psi11,700N/mm280.67
Tensile Strength(MD)ASTM D 3039/IPC-TM-650 2.4.19psi9,020N/mm262.19
Tensile Strength(CD)ASTM D 3039/IPC-TM-650 2.4.19psi7,740N/mm253.37
Elongation at Break(MD)ASTM D 3039/IPC-TM-650 2.4.19%1.89N/mm1.89
Elongation at Break(CD)ASTM D 3039/IPC-TM-650 2.4.19%1.7%1.7
Young's Modulus(MD)ASTM D 3039/IPC-TM-650 2.4.19psi667,000N/mm24,599
Young's Modulus(CD)ASTM D 3039/IPC-TM-650 2.4.19psi637,000N/mm24,392
Poisson's Ratio(MD)ASTM D 3039/IPC-TM-650 2.4.19 0.18 0.18
Poisson's Ratio(CD)ASTM D 3039/IPC-TM-650 2.4.19 0.23 0.18
Compressive ModulusASTM D 695(23)psi560,000N/mm23,861
Flexural Strength(MD)ASTM D 790/IPC-650 2.4.4psi1.46 x 106N/mm210,309
Flexural Strength(CD)ASTM D 790/IPC-650 2.4.4psi1.50 x 106N/mm210,076
Peel Stength(½ oz.CVH)IPC-650 2.4.8(Thermal Stress.)Ibs./inch7g/cm31.25
Thermal Conductivity(Unclad,125)ASTM F433(Guarded Heat Flow)W/(mK)0.6W/(mK)0.6
Thermal Conductivity(C1/C1,125)ASTM F433(Guarded Heat Flow)W/(mK)0.92W/(mK)0.92
Thermal Conductivity(CH/CH,125)ASTM F433(Guarded Heat Flow)W/(mK)0.87W/(mK)0.87
Dimensional Stability(MD)IPC-650-2.4.39 Sec.5.4(After Etch)mils/in.0.23mm/M0.23
Dimensional Stability(CD)IPC-650-2.4.39 Sec.5.4(After Etch)mils/in.0.64mm/M0.64
Dimensional Stability(MD)IPC-650-2.4.39 Sec.5.5(Thermal Stress.)mils/in.-0.04mm/M-0.04
Dimensional Stability(CD)IPC-650-2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.46mm/M0.46
Surface ResistivityIPC-650 2.5.17.1(after elevated temp.)Mohms8.33 x 107Mohms8.33 x 107
Surface ResistivityIPC-650 2.5.17.1(after humidity)Mohms6.42 x 107Mohms6.42 x 107
Volume ResistivityIPC-650 2.5.17.1(after elevated temp.)Mohms/cm5.19 x 108Mohms/cm5.19 x 108
Volume ResistivityIPC-650 2.5.17.1(after humidity)Mohms/cm2.91 x 108Mohms/cm2.91 x 108
CTE(X axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/11ppm/11
CTE(Y axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/13ppm/13
CTE(Z axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/34ppm/34
DensityASTM D 792g/cm32.35g/cm32.35
HardnessASTM D 2240(Shore D) 79.1 79.1
Strain at Break(MD)ASTM D 790/IPC-650 2.4.4%0.014%0.014
Strain at Break(CD)ASTM D 790/IPC-650 2.4.4%0.013%0.013
Specific HeatASTM E 1269-05,E 967-08,E968-02j/(g)0.94j/(g)0.94
Td(2% Weight Loss)IPC-650 2.4.24.6/TGAoF788420
Td(5% Weight Loss)IPC-650 2.4.24.6/TGAoF817436

 

 

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