Bicheng Electronics Technology Co., Ltd |
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Introducing our newly shipped PCB, a cutting-edge solution that combines exceptional performance and reliability. Crafted with precision using top-quality materials and advanced manufacturing processes. Let's delve into the key features of this remarkable product:
1. PCB Material:
- Constructed with Taconic TLY-5 PTFE Glass DK 2.2, ensuring
superior electrical performance and durability.
- The lead-free process enhances environmental friendliness.
- Designed to operate seamlessly in a wide temperature range, from
-40℃ to +85℃, making it suitable for various environments.
2. Stackup:
- This 4-layer rigid PCB features an optimized stackup design for
enhanced signal integrity and performance.
- Consists of alternating layers of finished copper (35um), TLY-5
dielectric (20 mil), FastRise-28 Prepreg (0.1mm), and finished
copper (35um), providing robust electrical conductivity and
insulation.
3. Construction Details:
- The board dimensions are 157mm x 112mm (2PCS), with a high level
of accuracy at +/- 0.15mm.
- Minimum Trace/Space: 9/9 mils, allowing for precise routing and
high-density designs.
- Minimum Hole Size: 0.4mm, facilitating versatile component
selection.
- Incorporates blind vias L1-L2, optimizing connectivity and design
flexibility.
- Finished board thickness: 1.2mm, striking a balance between
strength and flexibility.
- Features a 1 oz (1.4 mils) finished copper weight on all layers,
ensuring optimal electrical conductivity.
- Via plating thickness: 1 mil, enabling reliable interconnection
between layers.
- Surface finish: Immersion Gold, providing excellent solderability
and corrosion resistance.
- Top Silkscreen in White for clear component labeling and
identification.
- No Bottom Silkscreen, maintaining a clean and professional
aesthetic.
- Matt black Top and Bottom Solder Mask, offering exceptional
protection for the PCB traces and preventing solder bridging.
- No silkscreen on solder pads, ensuring precise soldering and
minimizing errors.
- Utilizes a 100% Electrical test for quality assurance and
reliability.
4. PCB Statistics:
- Accommodates a total of 80 components, allowing for versatile
circuit designs.
- Provides a total of 97 pads, offering ample connectivity options.
- Includes 59 Thru Hole Pads for secure and robust component
mounting.
- Features 38 Top SMT Pads for surface-mounted components,
expanding design possibilities.
- No Bottom SMT Pads, streamlining the layout.
- Incorporates 47 Vias for efficient signal routing.
- Provides 15 Nets, ensuring reliable interconnection between
components.
5. Type of Artwork Supplied: Gerber RS-274-X, the industry-standard format for PCB fabrication.
6. Accepted Standard: Compliant with IPC-Class-2 standards, guaranteeing high quality and reliability.
7. Service Area: Our exceptional PCB services are available worldwide, ensuring accessibility and convenience.
For any technical inquiries or questions, please feel free to contact Ivy at sales10@bichengpcb.com. Our team is dedicated to providing comprehensive support and assistance for your PCB needs.
PCB Material: | Lightweight Woven Fiberglass |
Designation: | TLY-5 |
Dielectric Constant: | 2.2 |
Dissipation Factor | 0.0009 10GHz |
Layer Count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper Weight: | 1oz (35µm), 2oz (70µm) |
Laminate Thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB Size: | ≤400mm X 500mm |
Solder Mask: | Green, Black, Blue, Yellow, Red etc. |
Surface Finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
TLY TYPICAL VALUES | |||||
Property | Test Method | Unit | Value | Unit | Value |
DK at 10 GHz | IPC-650 2.5.5.5 | 2.2 | 2.2 | ||
Df at 10 GHz | IPC-650 2.5.5.5 | 0.0009 | 0.0009 | ||
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
Dielectric Strength | ASTM D 149 | V/mil | 2,693 | V/mil | 106,023 |
Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 1010 | Mohms/cm | 1010 |
Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 1010 | Mohms/cm | 109 |
Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 108 | Mohms | 108 |
Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 108 | Mohms | 108 |
Flex Strength(MD) | IPC-650 2.4.4 | psi | 14,057 | N/mm2 | 96.91 |
Flex Strength(CD) | IPC-650 2.4.4 | psi | 12,955 | N/mm2 | 89.32 |
Peel Stength(½ oz.ed copper) | IPC-650 2.4.8 | Ibs./inch | 11 | N/mm | 1.96 |
Peel Stength(1 oz.CL1 copper) | IPC-650 2.4.8 | Ibs./inch | 16 | N/mm | 2.86 |
Peel Stength(1 oz..CV1 copper) | IPC-650 2.4.8 | Ibs./inch | 17 | N/mm | 3.04 |
Peel Stength | IPC-650 2.4.8(after elevated temp.) | Ibs./inch | 13 | N/mm | 2.32 |
Young's Modulus(MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 1.4 x 106 | N/mm2 | 9.65 x 103 |
Poisson's Ratio(MD) | ASTM D 3039/IPC-650 2.4.19 | 0.21 | 0.21 | ||
Thermal Conductivity | ASTM F 433 | W/M*K | 0.22 | W/M*K | 0.22 |
Dimensional Stability(MD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.038 | -0.038 | |
Dimensional Stability(CD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.031 | -0.031 | |
Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.19 | g/cm3 | 2.19 |
CTE(X axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 26 | ppm/℃ | 26 |
CTE(Y axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 15 | ppm/℃ | 15 |
CTE(Z axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 217 | ppm/℃ | 217 |
NASA Outgassing(% TML) | 0.01 | 0.01 | |||
NASA Outgassing(% CVCM) | 0.01 | 0.01 | |||
NASA Outgassing(% WVR) | 0.00 | 0.00 | |||
UL-94 Flammability Rating | UL-94 | V-0 | V-0 |
The reasons for choose of TLY-5
Unveiling the Powerhouse Performance of TLY-5
TLY-5 emerges as a powerhouse, boasting an extraordinary DK value
of 2.2 at 10 GHz. This value epitomizes its superior performance,
ensuring optimal signal transmission and minimizing signal loss.
Furthermore, its ultra-low Df value of 0.0009 at 10 GHz guarantees
pristine signal fidelity, making it the quintessential choice for
high-frequency applications.
Impeccable Electrical Properties for Uncompromised Signal Integrity
TLY-5 stands as a paragon of impeccable electrical properties,
equipped with a dielectric breakdown voltage surpassing 45 kV and a
dielectric strength of 106,023 V/mil. These attributes fortify its
insulation capabilities and provide steadfast protection against
electrical breakdown. Additionally, its high volume and surface
resistivity of 1010 Mohms/cm ensure exceptional electrical
conductivity, while simultaneously minimizing leakage currents.
Unmatched Reliability in Diverse Environments
With a meager moisture absorption rate of only 0.02%, TLY-5
showcases its resilience against environmental factors,
particularly humidity. Furthermore, its dimensional stability,
exhibiting minimal change of -0.038 mils/inch in the MD direction
and -0.031 mils/inch in the CD direction, guarantees unwavering
performance even under the duress of thermal stress.
Fortified Durability for Enduring Performance
TLY-5 possesses fortified durability, exemplified by its flexural
strength of 14,057 psi in the MD direction and 12,955 psi in the CD
direction. This exceptional mechanical strength enables TLY-5 to
withstand bending and flexing with unparalleled tenacity. Its peel
strength values ensure steadfast adhesion, even when encountering
varying copper weights, thus ensuring enduring performance in your
electronic endeavors.
Meeting Stringent Industry Standards: IPC-Class 2 Compliance
TLY-5 stands tall, meeting the stringent requirements outlined by
IPC-Class 2 standards. Its adherence to these rigorous industry
benchmarks ensures unwavering quality and reliability. Rest
assured, TLY-5 is engineered to surpass the demands of diverse
industries, providing you with unparalleled confidence in your
projects.