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[China]
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Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact name:Ivy Deng
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Rogers' RO4730G3 high frequency laminates are a dependable choice for antenna-grade printed circuit board substrates, offering a cost-effective alternative to traditional PTFE-based antenna substrates while enabling designers to fine-tune cost and performance. With a dielectric constant of 3 and a loss tangent of 0.0028 at 10 GHz, it also boasts a low thermal coefficient of dielectric constant (TCDk) of only 34 ppm/°C across a temperature range of -50°C to 150°C. Additionally, these high frequency PCBs have demonstrated low PIM performance, with a value of -165 dBc. The CTE values on both the X and Y axes are similar to that of copper, and the Z-axis CTE is impressively low at 30.3 ppm/°C. This superb CTE match significantly reduces stresses in the PCB antennas.
| Property | RO4730G3 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.5 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.98 | Z | 1.7 GHz to 5 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0028 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| 2.5 GHz | |||||
| Thermal Coefficient of ε | +34 | Z | ppm/℃ | -50 ℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | <0.4 | X, Y | mm/m | after etech +E2/150 ℃ | IPC-TM-650 2.4.39A |
| Volume Resistivity (0.030") | 9 X 107 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity (0.030") | 7.2 X 105 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| PIM | -165 | dBc | 50 ohm 0.060" | 43 dBm 1900 MHz | |
| Electrical Strength (0.030") | 730 | Z | V/mil | IPC-TM-650 2.5.6.2 | |
| Flexural Strength MD | 181 (26.3) | Mpa (kpsi) | RT | ASTM D790 | |
| CMD | 139 (20.2) | ||||
| Moisure Absorption | 0.093 | - | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Thermal Conductivity | 0.45 | Z | W/mK | 50℃ | ASTM D5470 |
| Coefficient of Thermal Expansion | 15.9 14.4 35.2 | X Y Z | ppm/℃ | -50 ℃to 288℃ | IPC-TM-650 2.4.4.1 |
| Tg | >280 | ℃ | IPC-TM-650 2.4.24 | ||
| Td | 411 | ℃ | ASTM D3850 | ||
| Density | 1.58 | gm/cm3 | ASTM D792 | ||
| Copper Peel Stength | 4.1 | pli | 1oz,LoPro EDC | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
