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Similar to Unirez 2633 polyamide resin B-208 for wood and plastic
POLYAMIDE HOT MELT ADHESIVE B-208
1. Description:
Polyamide Hot Melt Adhesive is the polycondensate of dimer acid and
diamine. It is solid at room temperature, but liquid uner melting
state with good liguidity and adhesive ability, and will form high
strength adhesion after solidifying and cooling. Polyamide hot melt
adhesive has excellent thermostability and flexibility, as well as
good solubility & melting properties at low
temperature.Yellowish granular transparent solid.
2. Properties:
Non-toxic, no irritant, dissolve in most organic solvents, insoluble in water. polyamide hot melt adhesive has a good solubility at low temperature, high temperature melting, excellent thermal stability and strong flexibility stretchability.
3. Specifications:
Item | B-208 |
Acid value (mgKOH/g) | ≤6 |
Amine value (mgKOH/g) | ≤6 |
Solvent viscosity* (mPa·s/25℃) | 250-450 |
Melt viscosity (mPa·s/160℃) | 3000-8000 |
Softening point (℃) | 110-130 |
Color (Fe-Co) | ≤8 |
4. Major Application:
mainly used for attire, shoes, leather, electronic devices, melting
adhesive. Also used for wood, plastic, metal,
5. Packing:
25kgs net per paper bag. 12MT/1X20`FCL with pallet
Packing image: