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Through-Hole Assembly Multilayer Communication PCB Prototype Printed Circuit Boards

Shenzhen Sky-Win Technology Co., Ltd

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Address: 4F&2F, Building 1st, Nanchang Huafeng Industrial Park,NanchangCommunity, Xixiang Town, Baoan District, Shenzhen, China

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Through-Hole Assembly Multilayer Communication PCB Prototype Printed Circuit Boards

Country/Region china
City & Province shenzhen
Categories Passive Components
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Product Details

Through-Hole Assembly Multilayer Communication PCB Prototype Printed Circuit Boards

 

 

Communication PCB Assembly  Description

 

PCB requirements in the field of communication can be divided into sub-fields such as communication equipment and mobile terminals. Among them, communication equipment mainly refers to the communication infrastructure used for wired or wireless network transmission, including communication base stations, routers, switches, backbone network transmission equipment, microwave transmission equipment, optical fiber to the home equipment

 

Communications PCB Material


Designing the best PCB solution for communications products requires careful selection of substrate laminates, prepregs, conductive layers, coatings and finishes. We use a range of materials specifically tailored to meet the electrical, mechanical and environmental performance standards required for these demanding applications.

 

Communication PCB Assembly Application

 

In the field of communication, communication PCB board is widely used in wireless network, transmission network, data communication. And fixed line broadband. Related PCB products include backboards, high-speed multilayer boards, high-frequency microwave boards, and multifunctional metal substrates.
PCB requirements in the field of communication are divided into subdivisions such as communication equipment and mobile terminals. Communication equipment is a communication infrastructure mainly used for wired or wireless network transmission. Including communication base stations, routers, switches, etc. Communication equipment mainly uses high-rise PCB boards, of which 8-16 layers account for about 42%. The mobile terminal is mainly HDI and flexible board.

 

Communications PCB Parameters​

 

Layer:8 layers
Surface:HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect.
Copper thickness:0.25 Oz -12 Oz
Material:FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers
Board thickness0.1 to 6.0mm(4 to 240mil)
Minimum line width/space0.076/0.076mm
Minimum line gap+/-10%
Outer layer copper thickness140um(bulk) 210um(pcb prototype)
Inner layer copper thickness70um(bulk) 150um(pcb protytype)
Min.finished hole size(Mechanical)0.15mm
Min.finished hole size (laser hole)0.1mm
Aspect ratio10:01(bulk) 13:01(pcb prototype)
Solder Mask ColorGreen,Blue,Black,White,Yellow,Red,Grey
Tolerance of dimension size+/-0.1mm
Tolerance of board thickness<1.0mm +/-0.1mm
Tolerance of finished NPTH hole size+/-0.05mm
Tolerance of finished PTH hole size+/-0.076mm
Delivery timeMass:10~12d/ Sample:5~7D

 

                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                    

 

 

 

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