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Black Solder Mask HDI PCB 6 Layer FR4 Material 0.6 MM Thickness

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Witgain Technology Limited

Black Solder Mask HDI PCB 6 Layer FR4 Material 0.6 MM Thickness

Country/Region china
City & Province shenzhen
Categories Welding Helmets
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Product Details

HDI PCB 6 Layer Black Solder Mask FR4 Material 0.6 MM Thickness

 

 

PCB Specifications:  

 

1 Part NO: HDIPCB0016

2 Layer Count: 6 Layer HDI PCB

3 Finished Board Thickness: 0.6MM

4 2+N+2 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM,L1-L6 0.2MM

5 Min Lind Space&Width:3/3mil

6 Copper Thickness: 1/H/H/H/H/1

7 Application Area: Mobile Phone Charge

8 PCB Size: 113.42mm*92.88mm/6pcs

9 PCB Drawing File Size: Gerber File

 

 

 

X-OUT per panel:

 

1 X-OUT panel must be packed separately and marked clearly

2 A black X must be permanently marked on both sides of pcb

3 X-OUT per panel not be over 25%

4 X-OUT per lot not be over 5%

 

 

PCB report have to include the following information:

 

1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage;

2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin;

3 Other: date code, quantity etc.

 

 

S1000-2 Data Sheet:

 

 

S1000-2
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC180
IPC-TM-650 2.4.24.4DMA185
TdIPC-TM-650 2.4.24.65% wt. loss345
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
After Tgppm/℃220
50-260℃%2.8
T260IPC-TM-650 2.4.24.1TMAmin60
T288IPC-TM-650 2.4.24.1TMAmin20
T300IPC-TM-650 2.4.24.1TMAmin5
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--100S No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.2 x 108
E-24/125MΩ.cm4.5 x 106
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance7.9 x 107
E-24/1251.7 x 106
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s100
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV63
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.013
IEC 61189-2-72110GHz--
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.38
125℃N/mm1.07
Flexural StrengthLWIPC-TM-650 2.4.4AMPa562
CWIPC-TM-650 2.4.4AMPa518
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
CTIIEC60112ARatingPLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

 

 

 

 

 

 

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