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Immersion Gold Plated Electronic Circuit Card 2 Layer PCB Half Hole 1.0 MM Thickness

Witgain Technology Limited
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Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111

Contact name:Steven YU

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Witgain Technology Limited

Immersion Gold Plated Electronic Circuit Card 2 Layer PCB Half Hole 1.0 MM Thickness

Country/Region china
City & Province shenzhen
Categories Advertising Screens
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Product Details

2 Layer PCB Half Hole 1.0 MM Thickness Immersion Gold

 

Board Info:

 

1 Part NO: Half hole PCB0007


2 Layer Count: 2 Layer PCB


3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM


4 Solder Mask: Black


5 Min Lind Space&Width: 4/4 mil


6 Application Area: Blue-tooth Module

 

7 Acceptance Standards: IPC 6012E CLASS2

 

8 Drawing File Format: Gerber File

 

 

Our Equipment List:

 

NOEquipment NameEquipment BrandEquipment QTY
1Automatic CuttingSCHCLLING-CA68581
2Roll CuttingQIXIAN2
3Vertical CuttingSHANGYUE2
4Innerlayer pretreatmentJIECHI4
5Automatic coat&wiringQUNYU4
6Automatic exposureCHUANBAO11
7Large table exposureHECHUAN2
8Laser PlotterORBOTEC3
9Etching lineKB4
10PE PunchingPE-30001
11AOIORBOTEC10
12Double row brownKB3
13PP CuttingZHENGYE5
14PP ChoppingZHONGDA2
15Hot-melt machineHANSONG6
16Riveting machineJIAOSHI6
17X-Ray CheckHAOSHUO5
18Automatic refluxLANDE2
19Steel plate washerFENGKAI2
20Large size pressDATIAN8热4冷
21X-Ray Drilling targetHAOSHUO8
22Ccd Drilling targetXUELONG10
23Automatic grindingXINHAO5
24Plate thickness MeasuringAISIDA2
25Four axis gongs machineDALIANG2
26Two axis gongs machineBIAOTEFU4
27Automatic grinding millJIEHUI2
28Drilling machineTONGTAI13
29Hole testing machineYAYA1
30Sinking rough millKB1
31Vertical copper wireYAMEI1
32Automatic electroplating lineJINMING1
33Dryer after electroplatingKB1
34Etch machineKB1
35Film checking machineYUBOLIN2
36Line pre-processingKB2
37Automatic laminatorZHISHENG3
38Outer exposure machineCHUANBAO8
39Outer exposure machineHECHUAN3
40Etch machineJULONG1
41Line developing machineKB1
42Sand blasting machineKB1
43Precoarsening pretreatmentKB2
44Electrostatic spraying lineFURNACE1
45Automatic screen printing machineHENGDAYOUCHUANG12
46Pre baked tunnel furnaceKB1
47Solder resist exposure machineCHUANBAO6
48Solder resist exposure machineHECHUAN2
49Post baked tunnel furnaceGC0-77BD2
50Solder resist developing machineKB1
51Screen printing machine1.8mm/2.0mm4
52Character baking tunnel furnaceGC0-77BD1
53Sunk Tin spray line 2
54Nickel palladium and gold wireXINHUAMEI1
55Alternator 2
56OSP lineKB1
57Gongs machineYIHUI20
58V-CUTZHENGZHI1
59CNC V-CUT machineCHENGZHONG2
60Hydraulic punch pressSRT2
61Test machineMASON17
62High speed flying needle testerWEIZHENGTAI3
63Four wire flying needle testerXIELI2
64Product washing machineKB2
65Plate warping machineXINLONGHUI2
66Vacuum packaging machineSHENGYOU4

 

 

FAQ:

 

Q1: What is an Annular Ring?

 

A1: A via is created by drilling a hole through a copper pad etched on each layer of a PCB. An Annular Ring is the area between the edge of the drilled via and the copper pad associated with that hole. The greater the width of an annular ring, the greater the copper connection around the drilled via will be.

In a multilayer PCB, traces are routed from one layer to another layer with the help of vias. These vias are the holes drilled through copper pads on the surface of the PCB. The amount of copper left around the via on both top and bottom sides of the PCB is called the annular ring.

Mathematically, an annular ring is the difference between the diameter of the hole and diameter of the pad divided by 2. For instance, if the diameter of the pad is 24 mils and the diameter of the hole is 12 mils then the width of the annular ring is [(24-12)/2] = 6 mils

 

Calculation of the width of an annular ring plays an important role at the time of PCB manufacturing. If the width of the annular ring is not enough then the hole could touch the boundaries of the pad, this condition is called ‘Tangency’. In the extreme situation, the hole could be outside the boundary of the pad which is termed as ‘Breakout’. Both these situations should be avoided during the process of PCB fabrication.

 

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