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1.0MM High Density Circuit Board HDI Multilayer Rigid Flex PCB FR4 Substrate

Witgain Technology Limited
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Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111

Contact name:Steven YU

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Witgain Technology Limited

1.0MM High Density Circuit Board HDI Multilayer Rigid Flex PCB FR4 Substrate

Country/Region china
City & Province shenzhen
Categories Plastic Sheets
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Product Details

HDI PCB 10 Layer 1.0MM Thickness Immersion Gold 2U' FR4 Substrate

 

 

PCB Specifications:  

 

1 Part NO: HDIPCB0005

2 Layer Count: 10 Layer HDI PCB

3 Finished Board Thickness: 1.0MM

4 Hole Structure: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM,

                        L7-L8 0.1MM, L8-L9 0.1MM, L1-L10 0.15MM

5 Min Lind Space&Width: 3/3mil

6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1

7 Application Area: Optical Module

 

 

 

Our production applications:

 

1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.

 

 

IT180A Data Sheet:

 

 

ItemsIPC TM-650Typical ValueUnit
Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil
2.4.85
8
lb/inch
Volume Resistivity2.5.17.11x109M-cm
Surface Resistivity2.5.17.11x108M
Moisture Absorption, maximum2.6.2.10.10%
Permittivity (Dk, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
4.5
4.4
--
Loss Tangent (Df, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
0.014
0.015
--
Flexural Strength, minimum
A. Length direction
B. Cross direction
2.4.4500-530
410-440
N/mm2
Thermal Stress 10 s at 288°C
A. Unetched
B. Etched
2.4.13.1Pass PassRating
FlammabilityUL94V-0Rating
Comparative Tracking Index (CTI)IEC 60112 / UL 746CTI 3 (175-249)Class (Volts)
Glass Transition Temperature(DSC)2.4.25175˚C
Decomposition Temperature2.4.24.6345˚C
X/Y Axis CTE (40℃ to 125℃)2.4.4111-13 / 13-15ppm/˚C
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C
2.4.2445
210
2.7
ppm/˚C ppm/˚C
%
Thermal Resistance
A. T260
B. T288
2.4.24.1>60
20
Minutes Minutes

 

 

 

 

 

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