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Maintainability PCB Board Design Rigid Flex Board Design Gold Finger Plating

TONGZHAN INDUSTRIAL LIMITED
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[China] country

Address: Room 1803, Middle Block,Fujing Building, Fuzhong Road, Futian district, Shenzhen China 518016 New website: https://www.tongzhanpcba.com/

Contact name:NICK CHENG

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TONGZHAN INDUSTRIAL LIMITED

Maintainability PCB Board Design Rigid Flex Board Design Gold Finger Plating

Country/Region china
City & Province shenzhen
Categories Electronics Production Machinery
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Product Details

Assemblability Medical Care PCB Board Design Thick Copper And Aluminum Boards

 

Prototype PCB Assembly Description:

1. In terms of product solutions, we support flexible supply, and one-stop service for SMT, post-welding, assembly, and testing.
2. There are various types of PCB boards: POP board, ordinary board, FPC board, rigid-flex board, and metal substrate.
3. With the smallest components (such as 01005), we are also a cooperative supplier that precisely matches the best strategy.

 

Prototype PCB Assembly Parameters:

ItemTechnical Parameter
Layer2-64
Thickness0.3-6.5mm
Copper Thickness0.3-12 oz
Min Mechanical Hole0.1mm
Min Laser Hole0.075mm
HDI1+n+1,2+n+2,3+n+3
Max Aspect Ratio20:01
Max Board Size650mm*1130mm
Min Width/Space2.4/2.4mil
Min Outline Tolerance±0.1mm
Impedance Tolerance±5%
Min PP Thickness0.06mm
Bow &Twist≤0.5%
MaterialsFR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Surface FinishedHASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special CapabilityGold Finger Plating, Peelable, Carbon ink

 

FAQ:

Q: Do you have MOQ restrictions?
We do not have any limit on order quantity and can support samples and mass production. The specific situation depends on the needs of customers and can be communicated with the staff.

 

Q: What are the payment terms we can accept?
We recommend that you use T/T, and other needs can be communicated with our staff.

 

Prototype PCB Assembly Introduction:

The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.

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