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High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device

TONGZHAN INDUSTRIAL LIMITED
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Address: Room 1803, Middle Block,Fujing Building, Fuzhong Road, Futian district, Shenzhen China 518016 New website: https://www.tongzhanpcba.com/

Contact name:NICK CHENG

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TONGZHAN INDUSTRIAL LIMITED

High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device

Country/Region china
City & Province shenzhen
Categories Solar Chargers
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Product Details

Designability Flexible Boards PCB Board Design Electronics Device High - Tg FR4

 

Prototype PCB Assembly Description:

1. Focus on component sourcing.
2. Management team with 10+ years of experience in the material.
3. PCB Component Sourcing Teams: Project department, Engineering department, Purchasing.
4. department, Quality department, Customs Declaration department.
5. Professional component validation engineers.
6. Professional BOM Engineers.

 

Prototype PCB Assembly Parameters:

ItemTechnical Parameter
Layer2-64
Thickness0.3-6.5mm
Copper Thickness0.3-12 oz
Min Mechanical Hole0.1mm
Min Laser Hole0.075mm
HDI1+n+1,2+n+2,3+n+3
Max Aspect Ratio20:01
Max Board Size650mm*1130mm
Min Width/Space2.4/2.4mil
Min Outline Tolerance±0.1mm
Impedance Tolerance±5%
Min PP Thickness0.06mm
Bow &Twist≤0.5%
MaterialsFR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Surface FinishedHASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special CapabilityGold Finger Plating, Peelable, Carbon ink

 

Prototype PCB Assembly Introduction:

The design of the printed circuit board is based on the circuit schematic diagram to realize the functions required by the circuit designer. The design of the printed circuit board mainly refers to the layout design, and the layout of external connections needs to be considered. Various factors such as the optimal layout of internal electronic components, the optimal layout of metal connections and vias, electromagnetic protection, heat dissipation, etc. Excellent layout design can save production costs and achieve good circuit performance and heat dissipation performance. Simple layout design can be realized by hand, and complex layout design needs to be realized by computer-aided design (CAD).

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