Active Member
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[China]
Address: Room 1803, Middle Block,Fujing Building, Fuzhong Road, Futian district, Shenzhen China 518016 New website: https://www.tongzhanpcba.com/
Contact name:NICK CHENG
TONGZHAN INDUSTRIAL LIMITED |
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Printed Circuit Board Design Rigid-Flex Boards Peelable High - Tg FR4
Printed Circuit Board Design Description:
The PCB assembly we produce includes rapid turn prototype PCB assembly, SMT/SMD assembly, through-hole assembly, hybrid technology (SMT/through-hole), turnkey assembly, consignment assembly, etc. They are widely used in industrial control, medical care, automotive electronics, communications, and the Internet. SMT, post welding, assembly to testing one-stop service supports flexible supply.
Printed Circuit Board Design Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.5-17.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Printed Circuit Board Design Introduction:
The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.
