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1 - 30 Layers ENIG Hasl PCB Printed Circuit Boards Manufacturers

Huaswin Electronics Co.,Limited
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Huaswin Electronics Co.,Limited

1 - 30 Layers ENIG Hasl PCB Printed Circuit Boards Manufacturers

Country/Region china
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Product Details

 

 

1 - 30 ENIG Hasl PCB Printed Circuit Boards Manufacturers

 

 

Huaswin Electronics is a professional Printed Circuit Board Manufacturer founded in Shenzhen China.   

 

Layer:                                14Layer
Material:                        FR4, RoHS compliance
PCB Thickness:         1.6mm+/-10%
Surface:                         Immersion Gold, Au thickness: min.2u"
E-Test:                          100%
Outgoing Reports:Final Inspection Report, E-Test Report, Solderability Test Report, Microsection Report and so on.
Inspection Standard:IPC-A-600H/IPC-6012B Class2 and IPC-A-600H/IPC-6012B class3
Certificates:UL, RoHS, ISO

 


PCB capability and services: 
1. Single-sided, double side & multi-layer PCB. FPC. Flex-Rigid PCB with competitive price, good quality and excellent service. 
2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. 
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. 
4. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard. 
5. Quantities range from Sample to mass order 
6.100% E-Test 
7. Qualified for CE and RoHS certificate 

 


PCBA capability and services: SMT (Surface mounting technology), COB, DIP. 
1. Material Sourcing Service 
2. SMT assembly and Through hole components insertion 
3. IC pre-programming / Burning on-line 
4. Function testing as requested 
5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 
6. OEM/ODM also welcomed 


What we need: 
*Gerber files of the bare PCB 
*Bill of materials to include: Manufacturer's part number, type of part, type of packaging, component locations listed by reference designators and quantity 
*Dimensional specifications for non-standard components 
*Assembly drawing, including any change notices 
*Final test procedures (if available) 

 


Packing Terms: 
(1)Inner packing: All the goods will be packed by vacuum 
(2)Outer packing: Standard carton 

 


Quick Leadtime 
Lead time for sample: 
2-3 days for single-sided board 
4-5 days for double-sided board 
6-7 days for multilayer board 
24-48 hours for urgent 
Lead time or opening Mould: 
3-5 days for normal mould 
5-7 days for hard mould 
Lead time for mass production 
5-7 days for single/double sided board 
7-10 days for multilayer board 

 

 

Detailed Specification of PCB Manufacturing

 

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, 

Aluminum-based material. 

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin,

 Hard Gold, OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing, Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling

 

 

 

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