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Electronic Printed Through Hole PCB Assembly Circuit Board Assembly PCBA Service

Huaswin Electronics Co.,Limited
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Contact name:Vicky Lee

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Huaswin Electronics Co.,Limited

Electronic Printed Through Hole PCB Assembly Circuit Board Assembly PCBA Service

Country/Region china
Categories Wiring Harness
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Product Details

 

Consumer electronic Printed Circuit Board Assembly Through Hole PCB Assembly PCBA Service

 

 

Specifications

 

1. Our professional engineering team can put your project into production in a short time. Sample pictures and

 BOM are needed to make customized products.Also we can supply for the copy of the PCB and PCBA ,so you

 just sent me the enquiry is ok ,we can do what you need to do !   

 2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured

according to customers' requests or samples. Plastic injection processing available.

3. Purchasing the electronic components for you to the production of the PCBA 

4. We have advanced equipment for through-hole and SMT DIP COB cable Assembly  

5. ROHS compliant and lead-free process.

6. In-circuit, functional tests& burn-in tests, full system test

7. High output to guarantee prompt delivery.

 

Welcome to Huaswin!

Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.

We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP

assembly ,IC pre-programming / burning on-line, testing, anti-static packing.

 

 

PCB capability and services: 


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers)

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. 
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment. 
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard. 
7. Quantities range from prototype to volume production. 
8. 100% E-Test

 

 

Detailed Specification of PCB Manufacturing

 

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide,

Aluminum-based material.

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin,

Hard Gold, OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling

 


PCB Assembly services: 

 

SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 

Through-hole Assembly 
Wave Soldering 
Hand Assembly and Soldering

Material Sourcing 
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design

 

 

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

 applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

When coated, it is clearly visible as a clear and shiny material.


Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

plastics, casings and print & packaging material

 

Testing Methods

AOI Testing
· Checks for solder paste 
· Checks for components down to 0201" 
· Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of: 
· BGAs 
· Bare boards 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

 component problems. 
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing

 

 

Detailed Specification of Pcb Assembly

 

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carries/CSP

Double-Sided SMT Assembly

Fine Pitch to 08 Mils

BGA Repair and Reball

Part Removal and Replacement-Same Day Service

3

Bare Board Size

Smallest:0.25x0.25 Inches

Largest:20x20 Inches

4

File Formats

Bill of Materials

Gerber Files

Pick-N-Place File(XYRS)

5

Type of Service

Turn-Key,Partial Turn-Key or Consignment

6

Component Packaging

Cut Tape

Tube

Reels

Loose Parts

7

Turn Time

15 to 20 days

8

Testing

AOI inspection

X-Ray inspection

In-Circuit testing

Functional test

 

 

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