150W 24VDC Thermoelectric Cooler Peltier Cold Plate Conditioner For
Lasers
System Assembly
Several methods for installing thermoelectric modules have been
developed, including: mechanical clamping, epoxy bonding, and
direct solder bonding. The individual requirements of the
application will determine which method is most appropriate,
however, mechanical clamping is by far the most common.
Thermoelectric modules are relatively strong in compression and
weak in shear. Whichever method of installation is used, it is
important to avoid excessive mechanical loading of the module.
Thermal resistance occurs at each interface of an assembly and
affects overall system performance. In mechanically-clamped
systems, the recommended flatness of interface surfaces should be
within 0.001”. Even with this degree of flatness, interface
materials must be used to fill in the small thermal gaps; typical
choices include silicone-based thermal grease, graphite foil, and
thermally-conductive pads.
Special care must be taken to insure that uniform pressure is
applied during installation. Recommended procedures for mechanical
clamping are illustrated in Figure 5.