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[China]
Trade Verify
Address: Rm. 201, Building 20, Tantou Western Industrial Park, Shajing, Bao an District, Shenzhen, China
Contact name:Rosy Shao
INFINITE AUTOMATION CO ., LIMITED |
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Verified Suppliers
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TR7007Q Plus SPI SMT Machine Pre Owned 3D Solder Paste Inspection
TR7007Q Plus High-Resolution Shadow Free 3D SPI with Enhanced 2D Lighting, for higher uniformity inspection, Pre-owned 3D Solder Paste Inspection (SPI) Machine
The TR7007Q Plus 3D SPI platform is equipped with an improved motion controller (EtherCAT) and an enhanced 2D lighting module. The TR7007Q Plus can accurately inspect low solder bridges and compensate for board warpage for eliminating local PCB deformation. The TR7007Q Plus is equipped with up to 4 projectors to ensure a shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.
Features:
• Enhanced 2D Lighting, for higher uniformity inspection.
• New motion controller, EtherCAT, for real-time measurements.
• Smart Factory solution with Real-time SPC Trends
• Closed Loop Ready: Feedback and Feedforward Capabilities
Specifications:
| Imaging Method | Stop-and-Go Imaging |
| Camera | 4 Mpix or 12 Mpix (factory setting) |
| Imaging Resolution | 5.5 μm, 6 μm, 10 μm , 15 µm (factory setting) |
| Lighting | Enhanced 2D Lights (RGB+W) |
| 3D Technology | 4-way Digital Fringe Pattern |
| Field of View | 4 MP Camera Link- @ 10 μm: 20.3x20.3 mm @ 15 μm: 30.5x30.5 mm 12 MP Camera Link- @ 5.5 μm: 22.5x16.5 mm @ 10 μm: 40.8x30.7 mm @ 15 μm: 61.2x46.1 mm 12 MP CoaXPress- @ 6 μm: 24.4x18.4 mm @ 10 μm: 40.8x30.7 mm Note: (1) TR7007Q Plus DL is not available for 5.5 μm with 12 MP Camera Link and 6 μm with 12 MP CoaXPress (2) The only configuration available for the TR7007LQ Plus is 6 μm with 12 MP CoaXPress |
| Imaging Speed | 4 MP Camera Link: Up to 3 FOV/sec 12 MP Camera Link: Up to 1.8 FOV/sec 12 MP CoaXPress: Up to 2.6 FOV/sec |
| Height Resolution | @10 μm/15 μm: 0.45 μm @5.5 μm/6 μm: 0.22 μm |
| Max. Solder Height | @10 μm/15 μm: 420 μm/750 μm @5.5 μm/6 μm: 210 μm/310 μm * on Calibration Target |
| X-Axis Control | Ballscrew + EtherCAT motion controller |
| Y-Axis Control | Ballscrew + EtherCAT motion controller |
| Z-Axis Control | Ballscrew + EtherCAT motion controller |
| X-Y Axis Resolution | 0.5 μm |
| Z-Axis Resolution | 1 μm |
| Max PCB Size | TR7007Q Plus: @5.5 & 6 μm - 400 x 330 mm, @10 & 15 μm - 510
x 460 mm TR7007Q Plus DL: @10 & 15 μm - 510 x 310 mm x 2 Lanes, 510 x 590 mm x 1 Lane TR7007LQ Plus: @6 μm - 765 x 610 mm |
| PCB Thickness | 0.6 - 5mm |
| Max PCB Weight | 3kg. Optional: 5kg |
| Top Clearance | @5.5 μm, 6 μm: 25 mm; @10 μm, 15 μm: 50 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm |
| Conveyor Height | 880 – 920 mm * SMEMA Compatible |
| Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
| Measurement | Height Area Volume Offset |
| WxDxH | TR7007Q Plus: 1000 x 1400 x 1650 mm TR7007Q Plus DL: 1000 x 1500 x 1650 mm TR7007LQ Plus: 1365 x 1720 x 1710 mm Note: not including signal tower, signal tower height 515 mm |
| Weight | TR7007Q Plus: 750 kg TR7007Q Plus DL: 830 kg TR7007LQ Plus: 982 kg |
